Method for measuring force of adhesive member for manufacturing display device

    公开(公告)号:US12167667B2

    公开(公告)日:2024-12-10

    申请号:US17443417

    申请日:2021-07-26

    Abstract: An apparatus for manufacturing a display device, includes: a stage; a temperature controlling portion on the stage, and to receive a member seated on the temperature controlling portion; and a jig portion facing the temperature controlling portion, the jig portion to move linearly, and to receive an adhesive member. The jig portion includes: a first support plate; a second support plate facing the first support plate; and a pressurization plate on the first support plate and the second support plate, the pressurization plate to receive the adhesive member thereon. An end of the pressurization plate is spaced further from the member than an end of the first support plate and an end of the second support plate when the member is seated on the temperature controlling portion.

    Method for measuring force of adhesive member for manufacturing display device

    公开(公告)号:US12219863B2

    公开(公告)日:2025-02-04

    申请号:US17443417

    申请日:2021-07-26

    Abstract: An apparatus for manufacturing a display device, includes: a stage; a temperature controlling portion on the stage, and to receive a member seated on the temperature controlling portion; and a jig portion facing the temperature controlling portion, the jig portion to move linearly, and to receive an adhesive member. The jig portion includes: a first support plate; a second support plate facing the first support plate; and a pressurization plate on the first support plate and the second support plate, the pressurization plate to receive the adhesive member thereon. An end of the pressurization plate is spaced further from the member than an end of the first support plate and an end of the second support plate when the member is seated on the temperature controlling portion.

    Display device and method for manufacturing the same

    公开(公告)号:US11653550B2

    公开(公告)日:2023-05-16

    申请号:US17210518

    申请日:2021-03-24

    CPC classification number: H01L27/3223 H01L27/3276 H05K1/189 H01L2227/323

    Abstract: A display device includes a display panel including a plurality of display pads at least some of which at least a portion extend in a first direction and are arranged in a second direction intersecting the first direction, and a flexible circuit board including circuit pads, at least some of which at are electrically connected to the display pads, and circuit lines connected to the circuit pads. The circuit pads include at least one dummy pad, and the circuit lines include a dummy circuit line, of which at least a portion of is connected to the at least one dummy pad. The dummy circuit line includes a first portion connected to the at least one dummy pad and a second portion spaced apart from the first portion by a gap.

    Flexible circuit film bonding apparatus and method of bonding flexible circuit film using the same

    公开(公告)号:US11515283B2

    公开(公告)日:2022-11-29

    申请号:US16799811

    申请日:2020-02-24

    Abstract: A flexible circuit film bonding apparatus includes: a stage configured to support a TFT substrate; a pressing head configured to press and heat a flexible circuit film attached on the TFT substrate with an anisotropic conductive film interposed therebetween; a backup plate configured to support and heat the TFT substrate positioned below the flexible circuit film; and a heating control unit configured to control a temperature of a lower surface of the pressing head and an upper surface of the backup plate, wherein the temperature of the upper surface of the backup plate is less than 170 degrees Celsius.

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