公开(公告)号：US20250162315A1

公开(公告)日：2025-05-22

申请号：US18949036

申请日：2024-11-15

Applicant: Samsung Display Co., Ltd.

Inventor： Seora Kim ,  Donghoon Lee ,  Gyutae Kim ,  Sukbeom You

IPC: B41J2/085 ,  B41J2/06 ,  B41J2/10 ,  B41J2/14

Abstract: An inkjet printing head includes a chamber storing ink, a nozzle plate disposed under the chamber, connected to an inside of the chamber, and including a plurality of nozzles that discharge the ink to outside through a bottom surface of the chamber, a plurality of driving electrodes each disposed to be adjacent to the plurality of nozzles, respectively, inside the nozzle plate, and a plurality of shielding electrodes disposed inside the nozzle plate, wherein each of the plurality of shielding electrodes is disposed between the plurality of nozzles.

公开(公告)号：US11347342B2

公开(公告)日：2022-05-31

申请号：US17366246

申请日：2021-07-02

Applicant: Samsung Display Co., LTD.

Inventor： Seong-Sik Park ,  Gyutae Kim ,  San Park ,  Sung Soo Lee

IPC: G06F3/041 ,  G06F1/18 ,  H05K1/18

Abstract: A substrate conductive bonding structure includes a lower substrate including a connection pad exposed to outside the lower substrate, an upper substrate including a transfer pad overlapping the connection pad, exposed to outside the upper substrate and including an upper surface, and a slit defined in the transfer pad, overlapping the connection pad and open at the upper surface of the transfer pad, the slit including an extending portion extending along a first direction and having a first slit width along a second direction crossing the first direction, and an expansion portion connected to the extending portion and having a second slit width along the second direction which is larger than the first slit width, and a solder contacting the upper surface of the connection pad, extending to the upper surface of the transfer pad and into the slit.