公开(公告)号：US11347342B2

公开(公告)日：2022-05-31

申请号：US17366246

申请日：2021-07-02

Applicant: Samsung Display Co., LTD.

Inventor： Seong-Sik Park ,  Gyutae Kim ,  San Park ,  Sung Soo Lee

IPC: G06F3/041 ,  G06F1/18 ,  H05K1/18

Abstract: A substrate conductive bonding structure includes a lower substrate including a connection pad exposed to outside the lower substrate, an upper substrate including a transfer pad overlapping the connection pad, exposed to outside the upper substrate and including an upper surface, and a slit defined in the transfer pad, overlapping the connection pad and open at the upper surface of the transfer pad, the slit including an extending portion extending along a first direction and having a first slit width along a second direction crossing the first direction, and an expansion portion connected to the extending portion and having a second slit width along the second direction which is larger than the first slit width, and a solder contacting the upper surface of the connection pad, extending to the upper surface of the transfer pad and into the slit.