公开(公告)号：US20250081756A1

公开(公告)日：2025-03-06

申请号：US18737762

申请日：2024-06-07

Applicant: Samsung Display Co., LTD.

Inventor： SUNKWANG KIM ,  DONG-YOON LEE ,  SEONGYOUNG LEE ,  JEONGHYUN LEE ,  HANUL LEE ,  KANGMOON JO

IPC: H10K59/124 ,  H10K59/122

Abstract: A display panel includes a base layer including a display area including a transmissive area and a non-display area adjacent to the display area, a first insulating layer; a transistor on the first insulating layer, a third insulating layer that covers the transistor, a first connection electrode connected to a semiconductor pattern through a contact hole defined in the third insulating layer, a fourth insulating layer that covers the first connection electrode, a pixel defining layer including a display opening not overlapping the transmissive area, and a light emitting element, wherein the fourth insulating layer includes a first insulating opening overlapping the transmissive area, and the pixel defining layer includes a transmissive opening overlapping the first insulating opening.

公开(公告)号：US20240349560A1

公开(公告)日：2024-10-17

申请号：US18432756

申请日：2024-02-05

Applicant: Samsung Display Co., LTD.

Inventor： JEONGHYUN LEE ,  Pil Gyu KANG ,  Young Hoon YOO ,  EUNA YU ,  HANUL LEE ,  SANGCHEON HAN

IPC: H10K59/131 ,  H10K59/121

CPC classification number: H10K59/1315 ,  H10K59/1213

Abstract: A light emitting display device includes a substrate, a first conductive layer disposed on the substrate, a first insulating layer covering the first conductive layer, a semiconductor layer disposed on the first insulating layer, a second insulating layer disposed on the semiconductor layer, a second conductive layer disposed on the second insulating layer, and a data pad electrode disposed in an outer side of a display area. The first conductive layer is formed as a triple layer including a lower layer, an intermediate layer, and an upper layer. The data pad electrode and the first conductive layer are formed as the same triple layer, the lower layer of the triple layer includes titanium, the intermediate layer of the triple layer includes copper, and the upper layer of the triple layer includes an alloy of molybdenum and titanium.