公开(公告)号：US20160214133A1

公开(公告)日：2016-07-28

申请号：US14848937

申请日：2015-09-09

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Hak-Min KIM

IPC: B05B15/04 ,  B05B9/00

CPC classification number: H01L51/0008 ,  C23C14/24

Abstract: A deposition source includes first and second modules to store a deposition material, and to heat and evaporate the deposition material, a plurality of nozzles in each of the first and second modules to spray an evaporated deposition material, and first and second angle restriction plates along the first and second modules to limit a movement direction of the evaporated deposition material sprayed from the nozzles, wherein the first and second angle restriction plates are parallel to each other, and heights of first upper portions of the first and second angle restriction plates are lower than heights of second upper portions of the first and second angle restriction plates, the first upper portions being between the first and second modules, and the second upper portions being along the first and second modules.

Abstract translation: 沉积源包括用于存储沉积材料的第一和第二模块，以及加热和蒸发沉积材料，在第一和第二模块的每一个中的多个喷嘴，以喷射蒸发的沉积材料，以及沿着第一和第二角度限制板 所述第一和第二模块限制从所述喷嘴喷射的蒸发的沉积材料的移动方向，其中所述第一和第二角度限制板彼此平行，并且所述第一和第二角度限制板的第一上部的高度较低 比第一和第二角度限制板的第二上部的高度高，第一上部位于第一和第二模块之间，第二上部沿着第一和第二模块。

公开(公告)号：US20250098512A1

公开(公告)日：2025-03-20

申请号：US18787845

申请日：2024-07-29

Applicant: Samsung Display Co., LTD.

Inventor： Jong-Hee LIM ,  Jaeil KIM ,  Hak-Min KIM ,  Hyoung-Joo KIM ,  Jin Pyung LEE ,  Eun Su JUN ,  Il Young JEONG ,  Sang Sun HAN

IPC: H10K71/00 ,  B23K26/082 ,  B23K26/142 ,  B23K26/38

Abstract: A suction unit control method includes simulating an air flow about a suction port, through which fumes generated when a laser beam is radiated on a target substrate on a stage unit to cut the target substrate are sucked up, installing an air blower on three or four sides around a laser cutting end at a height close to the suction port, controlling on and off of first to fourth solenoid valves of the air blower based on a movement of the stage unit while performing laser cutting on the target substrate while moving the stage unit.