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公开(公告)号：US20240276765A1
公开(公告)日：2024-08-15
申请号：US18463106
申请日：2023-09-07
Applicant: Samsung Display Co., LTD.
Inventor： Hyoung Joo KIM , Jong Hee LIM , Eun Su JUN , Il Young JEONG , Hak Min KIM
CPC classification number: H10K59/1201 , B25J11/0055 , B25J15/0028 , H10K59/873 , H10K59/8793 , H10K59/88 , H10K71/851
Abstract: A robot arm is provided that includes: a first gripper having a first contact surface; a second gripper having a second contact surface corresponding to the first contact surface and an opening in the second contact surface; and a stopper including a pin protruding toward the first gripper. The stopper is configured to pass through the opening in the second gripper. As provided are a dummy removal system including the robot arm and a method of driving the dummy removal system to remove a polarization structure of a display panel.
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公开(公告)号：US20180154482A1
公开(公告)日：2018-06-07
申请号：US15798849
申请日：2017-10-31
Applicant: Samsung Display Co., Ltd.
Inventor： Il Young JEONG , Gyoo Wan HAN
IPC: B23K26/067 , B23K26/06
CPC classification number: B23K26/0673 , B23K26/0608 , B23K26/0643 , B23K26/0648 , B23K26/0652 , B23K26/0665
Abstract: A laser processing apparatus includes: a scanner configured to adjust a path of at least one of a first laser beam and a second laser beam; and a lens unit configured to condense the first laser beam and the second laser beam received from the scanner. The scanner may include a first reflection member for providing the first laser beam to the lens unit and a second reflection member for providing the second laser beam to the first reflection member.
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公开(公告)号：US20160114617A1
公开(公告)日：2016-04-28
申请号：US14986973
申请日：2016-01-04
Applicant: Samsung Display Co., Ltd. , Philoptics Co., Ltd.
Inventor： Il Young JEONG , Tae Yong KIM , Cheol Lae ROH , Je Kil RYU , Jeong Hun WOO , Gyoo Wan HAN , Ki Su HAN , Tae Hyoung CHO , Jong Nam MOON
IPC: B44C1/22
CPC classification number: B44C1/228 , B23K26/0626 , B23K26/38 , C03B33/0222 , C03B33/07 , C03B33/082 , C03B33/091 , H01L21/78
Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.
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公开(公告)号：US20230068009A1
公开(公告)日：2023-03-02
申请号：US17735481
申请日：2022-05-03
Applicant: Samsung Display Co., LTD.
Inventor： Hyoung Joo KIM , Joong Bae PYOUN , Il Young JEONG
Abstract: According to an embodiment, an apparatus for manufacturing a display device includes a stage on which a target substrate is mounted, and a suction unit positioned above the stage. The suction unit includes a main body including an outer box with top and bottom openings and an inner cup disposed in the outer box, a light emitting unit disposed on at least one inner surface of the outer box, the light emitting unit providing light, and a light receiving unit disposed opposite to the light emitting unit, and disposed on at least one inner surface of the outer box, the light receiving unit receiving the light provided from the light emitting unit.
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Patent Agency Ranking
5.发明申请公开(公告)号：US20180313991A1
公开(公告)日：2018-11-01
申请号：US15715752
申请日：2017-09-26
Applicant: Samsung Display Co., Ltd.
Inventor： Geun Woo Yug , Jung Hwa YOU , Il Young JEONG , Soo Bum PARK , Myeong Seok JEONG
IPC: G02B5/30 , B23K26/40 , B23K26/351
Abstract: A polarizing layer includes a base film and a deformation part provided in an edge of the base film. The deformation part includes first deformation parts formed as the base film is deformed by heat, and at least one second deformation part provided between the first deformation parts adjacent to each other.
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公开(公告)号：US20250098512A1
公开(公告)日：2025-03-20
申请号：US18787845
申请日：2024-07-29
Applicant: Samsung Display Co., LTD.
Inventor： Jong-Hee LIM , Jaeil KIM , Hak-Min KIM , Hyoung-Joo KIM , Jin Pyung LEE , Eun Su JUN , Il Young JEONG , Sang Sun HAN
IPC: H10K71/00 , B23K26/082 , B23K26/142 , B23K26/38
Abstract: A suction unit control method includes simulating an air flow about a suction port, through which fumes generated when a laser beam is radiated on a target substrate on a stage unit to cut the target substrate are sucked up, installing an air blower on three or four sides around a laser cutting end at a height close to the suction port, controlling on and off of first to fourth solenoid valves of the air blower based on a movement of the stage unit while performing laser cutting on the target substrate while moving the stage unit.
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公开(公告)号：US20230191533A1
公开(公告)日：2023-06-22
申请号：US17888717
申请日：2022-08-16
Applicant: Samsung Display Co., LTD.
Inventor： Akifumi SANGU , Hyoung Joo KIM , Jung Hwa YOU , Il Young JEONG
IPC: B23K26/082 , B23K26/06
CPC classification number: B23K26/082 , B23K26/0648 , B23K26/0643
Abstract: A laser processing apparatus includes a laser source; a width adjuster that adjusts a width of a laser beam irradiated from the laser source; and a scanner that adjusts an irradiation direction of the laser beam having passed through the width adjuster, wherein the width adjuster includes a first width adjusting portion and a second width adjusting portion arranged on a traveling direction of the laser beam, a focal length of the first width adjusting portion is equal to or greater that about 20,000 mm and a focal length of the second width adjusting portion is equal to or greater than about 20,000 mm.
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8.发明申请公开(公告)号：US20210181397A1
公开(公告)日：2021-06-17
申请号：US17190092
申请日：2021-03-02
Applicant: Samsung Display Co., Ltd.
Inventor： Geun Woo YUG , Jung Hwa YOU , Il Young JEONG , Soo Bum PARK , Myeong Seok JEONG
IPC: G02B5/30 , B23K26/351 , B23K26/40 , G02F1/1335
Abstract: A polarizing layer includes a base film and a deformation part provided in an edge of the base film. The deformation part includes first deformation parts formed as the base film is deformed by heat, and at least one second deformation part provided between the first deformation parts adjacent to each other.
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公开(公告)号：US20150108089A1
公开(公告)日：2015-04-23
申请号：US14324825
申请日：2014-07-07
Applicant: Samsung Display Co., Ltd. , Philoptics Co., Ltd.
Inventor： Il Young JEONG , Tae Yong KIM , Cheol Lae ROH , Je Kil RYU , Jeong Hun WOO , Gyoo Wan HAN , Ki Su HAN , Tae Hyoung CHO , Jong Nam MOON
IPC: B44C1/22
CPC classification number: B44C1/228 , B23K26/0626 , B23K26/38 , C03B33/0222 , C03B33/07 , C03B33/082 , C03B33/091 , H01L21/78
Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.
Abstract translation: 一种用于切割衬底的方法包括：作为第一激光辐射处理的一部分，朝向衬底的表面辐射激光，以在衬底中形成第一凹槽。 朝向表面辐射激光包括依次将激光朝向第一外部点（FOP），第二外部点（SOP），第一中间点（FIP），第二中间点（SIP）和第一外部点 切割点（FCP），每个点彼此间隔开一个或多个距离。 FCP对应于基板的切割线。 FOP和SOP分别设置在FCP的侧面。 FIP位于FCP和FOP之间。 SIP位于FCP和SOP之间。 相同种类和强度的激光辐射到每个点。
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