公开(公告)号：US11782479B2

公开(公告)日：2023-10-10

申请号：US17090717

申请日：2020-11-05

Applicant: Samsung Display Co., LTD.

Inventor： Sang Keun Lee ,  Hanjong Yoo

IPC: C23F1/16 ,  G06F1/16 ,  H01L21/673 ,  G02B1/118 ,  H01L21/768 ,  H04N23/57

CPC classification number: G06F1/1626 ,  G02B1/118 ,  G06F1/1605 ,  H01L21/67366 ,  H01L21/76886 ,  H04N23/57

Abstract: A method of manufacturing an electronic apparatus includes the steps of: providing an electronic panel defining a through hole; providing an electronic module having at least a portion thereof received in the through hole; providing a protective member having a first surface adjacent to the electronic panel, a hole area overlapping the through hole, a peripheral area surrounding the hole area, and a second surface facing the first surface and spaced apart from the electronic module, the providing of the protective member including: providing an unfinished protective member; attaching a film to the peripheral area; and forming a generally concave-convex pattern by contacting an acid solution with the hole area.