BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING THE SAME

    公开(公告)号:US20210305201A1

    公开(公告)日:2021-09-30

    申请号:US17123836

    申请日:2020-12-16

    Abstract: A method of fabricating a display device may include disposing a display panel on a stage to be parallel to an XZ-plane defined by a horizontal X-axis and a vertical Z-axis, measuring a height of a first side surface of the display panel in a direction of the Z-axis, rotating the stage such that the first side surface is parallel to a reference horizontal line in case that a result of the measured height indicates that the first side surface includes an inclined surface, moving the display panel in a direction of the Z-axis such that a first pad disposed on the first side surface overlaps the reference horizontal line, and bonding a second pad of a printed circuit board with the first pad.

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