BACKLIGHT UNIT AND DISPLAY DEVICE INCLUDING THE SAME

    公开(公告)号:US20230168539A1

    公开(公告)日:2023-06-01

    申请号:US18102757

    申请日:2023-01-29

    IPC分类号: G02F1/13357 G02F1/1333

    摘要: A backlight unit includes: a base substrate in which a light emitting area and a non-light emitting area are defined; a wiring layer including: a lower conductive layer disposed on the base substrate; an intermediate conductive layer disposed on the lower conductive layer; and an upper conductive layer disposed on the intermediate conductive layer; a light emitting element disposed on the wiring layer in the light emitting area; a connection member electrically connecting the light emitting element and the wiring layer, the connection member contacting the intermediate conductive layer of the wiring layer and the light emitting element; a backlight flexible substrate electrically connected to the wiring layer in the non-light emitting area; and a pad connection member electrically connecting the wiring layer and the backlight flexible substrate in the non-light emitting area, the pad connection member contacting the upper conductive layer of the wiring layer.

    BACKLIGHT UNIT AND DISPLAY DEVICE INCLUDING THE SAME

    公开(公告)号:US20210033925A1

    公开(公告)日:2021-02-04

    申请号:US16892611

    申请日:2020-06-04

    IPC分类号: G02F1/13357 G02F1/1333

    摘要: A backlight unit including: a base substrate in which a light emitting area and a non-light emitting area are defined; a wiring layer including: a lower conductive layer disposed on the base substrate; an intermediate conductive layer disposed on the lower conductive layer; and an upper conductive layer disposed on the intermediate conductive layer; a light emitting element disposed on the wiring layer in the light emitting area; a connection member electrically connecting the light emitting element and the wiring layer, the connection member contacting the intermediate conductive layer of the wiring layer and the light emitting element; a backlight flexible substrate electrically connected to the wiring layer in the non-light emitting area; and a pad connection member electrically connecting the wiring layer and the backlight flexible substrate in the non-light emitting area, the pad connection member contacting the upper conductive layer of the wiring layer.