公开(公告)号：US20240339364A1

公开(公告)日：2024-10-10

申请号：US18517343

申请日：2023-11-22

Applicant: Samsung Display Co., LTD.

Inventor： Hee Jung LEE ,  Hong Gi MIN ,  Jong Sung KIM ,  Sang Jin LEE ,  Myung Soo HUH

IPC: H01L21/66 ,  H01L33/00

CPC classification number: H01L22/20 ,  H01L33/005

Abstract: An apparatus for fabricating a display panel includes a loading plate on which a fabrication substrate is loaded, a plurality of optical microscopes that captures the fabrication substrate and alignment marks of the fabrication substrate, a gripper driver that aligns the fabrication substrate by adjusting a gap between gripper units and rotating the gripper units; and a substrate alignment controller that calculates an amount of rotation correction for the gripper units based on a deviated angle of the fabrication substrate to supply it to the gripper driver, calculates a gripper gap setting value for adjusting the gap between the gripper units using a residual of the aligned fabrication substrate, and provides the gripper gap setting value to the gripper driver.

公开(公告)号：US20250135792A1

公开(公告)日：2025-05-01

申请号：US18800309

申请日：2024-08-12

Applicant: Samsung Display Co., LTD.

Inventor： Hee Jung LEE ,  Hong Gi MIN ,  Jong Sung KIM ,  Sang Jin LEE ,  Myung Soo HUH

IPC: B41J13/32 ,  B41J3/28 ,  B41M5/00

Abstract: An ink-jet printing apparatus includes: a stage on which a substrate including first and second alignment marks is mounted; an ink-jet head part discharging ink; a mark measuring part measuring a first coordinate of each of the first and second alignment marks during a first compensation period, the mark measuring part measuring a second coordinate of the first alignment mark during a second compensation period; and a substrate fixing part holding the substrate. The substrate fixing part performs a first operation to move the substrate such that the first coordinates of the first and second alignment marks in a first direction align with each other during the first compensation period, and performs a second operation to move the substrate according to a result obtained by comparing the second coordinate of the first alignment mark with a reference coordinate of the first alignment mark during the second compensation period.