公开(公告)号：US20240060172A1

公开(公告)日：2024-02-22

申请号：US18203702

申请日：2023-05-31

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jun Hyeuk KO ,  Jae Suk MOON ,  Min Goo KANG ,  Eui Gyu KIM ,  Min Chul SONG ,  Suk Ha RYU ,  Young Sun CHO

IPC: C23C14/50 ,  C23C14/04 ,  C23C14/24

CPC classification number: C23C14/50 ,  C23C14/042 ,  C23C14/24

Abstract: A deposition apparatus for depositing a deposition material on a base substrate disposed on a mask, includes: a mask assembly including a mask frame which defines an opening therein and surrounds the opening, and the mask disposed on the mask frame; an electrostatic chuck disposed on the base substrate; and a plate disposed on the electrostatic chuck. The electrostatic chuck includes a plurality of magnetic bodies, and a magnetic property of at least one magnetic body among the plurality of magnetic bodies is different from a magnetic property of remaining magnetic bodies except for the at least one magnetic body among the plurality of magnetic bodies.

公开(公告)号：US20250079135A1

公开(公告)日：2025-03-06

申请号：US18739197

申请日：2024-06-10

Applicant: Samsung Display Co., Ltd.

Inventor： Jun Hyeuk KO ,  Jong Bum KIM ,  Young Kwang LEE ,  Min Goo KANG ,  Suk Ha RYU ,  Min Chul SONG ,  Min A WOO

IPC: H01J37/32 ,  C23C14/04 ,  C23C14/50

Abstract: A deposition apparatus including: a base substrate; an electrostatic chuck on the base substrate; and a plate on the electrostatic chuck. The plate has a first area in which first magnet units are arranged and a second area in which second magnet units are arranged. The first magnet units are spaced apart from each other at a first distance, and the second magnet units are spaced apart from each other at a second distance. The second distance is greater than the first distance.

公开(公告)号：US20240039431A1

公开(公告)日：2024-02-01

申请号：US18107049

申请日：2023-02-08

Applicant: Samsung Display Co., LTD.

Inventor： Jun Hyeuk KO ,  Min Goo KANG ,  Suk Ha RYU ,  Min Seok KIM ,  Eui Gyu KIM ,  Min Chul SONG ,  Young Sun CHO

IPC: H02N13/00 ,  C23C14/04 ,  C23C14/50

CPC classification number: H02N13/00 ,  C23C14/042 ,  C23C14/50

Abstract: A deposition apparatus includes a plate; electrostatic chucks including a first surface on which the plate is disposed; and a second surface on which a substrate is supported; and a control device that controls a flatness between the electrostatic chucks, and each of the electrostatic chucks includes driving shafts disposed through an area of an edge of the first surface of each of the electrostatic chucks, and the control device controls the flatness between the electrostatic chucks through the driving shafts by measuring a height deviation between the electrostatic chucks.