公开(公告)号：US20150190832A1

公开(公告)日：2015-07-09

申请号：US14288959

申请日：2014-05-28

Applicant: Samsung Display Co., Ltd.

Inventor： Jeong Ho YI ,  Sun Ho KIM ,  Cheol Rae JO ,  Myung Soo HUH

IPC: B05B12/14 ,  B05C9/12 ,  B05B7/16 ,  B05B7/24 ,  B05D1/00 ,  B05D3/06

CPC classification number: B05C9/12 ,  B05D1/02 ,  B05D3/067 ,  B05D7/546 ,  H01L51/0005

Abstract: A thin film forming apparatus comprises a first storage unit, a first nozzle unit, a first light-irradiating unit, a second storage unit, a second nozzle unit, and a second light-irradiating unit. The first storage unit is configured to store a first organic material. The first nozzle unit is connected to the first storage unit and is configured to spray the first organic material stored in the first storage unit. The first light-irradiating unit is disposed adjacent to the first nozzle unit and is configured to irradiate light having a wavelength that cures the first organic material. The second storage unit is configured to store a second organic material. The second nozzle unit is disposed adjacent to the first nozzle unit, is connected to the second storage unit, and is configured to spray the second organic material stored in the second storage unit. The second light-irradiating unit is disposed adjacent to the second nozzle unit and is configured to irradiate light having a wavelength that cures the second organic material.

Abstract translation: 薄膜形成装置包括第一存储单元，第一喷嘴单元，第一光照单元，第二存储单元，第二喷嘴单元和第二光照单元。 第一存储单元被配置为存储第一有机材料。 第一喷嘴单元连接到第一存储单元，并被配置为喷射存储在第一存储单元中的第一有机材料。 第一光照射单元设置成与第一喷嘴单元相邻，并且被配置为照射具有固化第一有机材料的波长的光。 第二存储单元被配置为存储第二有机材料。 第二喷嘴单元设置成与第一喷嘴单元相邻，连接到第二存储单元，并且被配置为喷射存储在第二存储单元中的第二有机材料。 第二光照射单元与第二喷嘴单元相邻设置，并且被配置为照射具有固化第二有机材料的波长的光。

公开(公告)号：US20240274456A1

公开(公告)日：2024-08-15

申请号：US18414773

申请日：2024-01-17

Applicant: Samsung Display Co., Ltd.

Inventor： Cheol Rae JO ,  Seung Ho MYOUNG ,  Yeong Min KIM ,  Yong U JEONG

IPC: H01L21/683 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/6833 ,  H01L21/02631 ,  H01L21/68742

Abstract: A substrate planarization device according to embodiments of the present disclosure may include a peripheral coupler including a first electrostatic chuck configured to be attached to a peripheral area of a substrate, and a first elevator configured to raise and lower the first electrostatic chuck in a vertical direction within a first movable range, and a central coupler including a second electrostatic chuck configured to be attached to a central area of the substrate, and a second elevator that is configured to raise and lower the second electrostatic chuck in the vertical direction within a second movable range that is greater than the first movable range. According to the substrate planarization device, a deposition system comprising the same, and a method of operating the substrate planarization device according to embodiments of the present disclosure, the substrate can be planarized.