公开(公告)号：US20230366627A1

公开(公告)日：2023-11-16

申请号：US18132654

申请日：2023-04-10

Applicant: Samsung Display Co., Ltd.

Inventor： MINSU KIM ,  DONG-WOOK SONG ,  HONGROK JANG

IPC: F27D7/02 ,  F27D9/00

CPC classification number: F27D7/02 ,  F27D9/00 ,  F27D2007/023 ,  F27D2009/0075

Abstract: A heat treatment device includes a chamber accommodating a work substrate including a first organic layer, a heater part which is disposed in the chamber and heats the work substrate, an air supply part including a first nozzle which supplies an external air to the chamber, a second nozzle which is disposed in the first nozzle and supplies a process gas to the chamber, and a cover part provided through which an opening overlapping the second nozzle is defined and which is disposed at an end of the first nozzle, which is adjacent to an outlet of the first nozzle, and an air exhaust part exhausting particles in the chamber to an outside of the chamber.