BONDING APPARATUS
    1.
    发明公开
    BONDING APPARATUS 审中-公开

    公开(公告)号:US20240120311A1

    公开(公告)日:2024-04-11

    申请号:US18230825

    申请日:2023-08-07

    Abstract: A bonding apparatus includes: a chamber including a light transmission part configured to transmit light irradiated onto a substrate on which at least one chip is disposed; and a light generation part disposed on the chamber and configured to irradiate the light. The light transmission part may include an absorption prevention layer, in which a plurality of through-holes are defined, and a light diffusion layer that diffuses the light passing through the plurality of through-holes to reduce heat generation in the light transmission part and uniformly irradiate the light passing through the light transmission part onto the substrate on which at least one chip is disposed.

    INKJET APPARATUS AND METHOD OF ALIGNING THE SAME

    公开(公告)号:US20230191776A1

    公开(公告)日:2023-06-22

    申请号:US17880077

    申请日:2022-08-03

    CPC classification number: B41J2/04505 B41J2/07 B41J2/155

    Abstract: An inkjet apparatus includes a head pack including sub-head packs, at least one inkjet head coupled to each of the sub-head packs, a head pack aligner coupled to each of the sub-head packs, and including a first motor which moves each of the sub-head packs in a first rotation direction, a second motor which is disposed on the first motor and moves each of the sub-head packs in a first direction which is a longitudinal direction of each of the sub-head packs in a plan view, and a controller which controls a moving position of each of the sub-head packs and a head aligner coupled to the inkjet head and including a first adjusting member which moves the inkjet head in a second rotation direction and a second adjusting member which moves the inkjet head in a second direction which is a longitudinal direction of each of the inkjet head.

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