Display device
    2.
    发明授权

    公开(公告)号:US11985873B2

    公开(公告)日:2024-05-14

    申请号:US17444401

    申请日:2021-08-04

    CPC classification number: H10K59/131 H10K59/40

    Abstract: A display device includes: a display area having a plurality of sub-pixels; a plurality of pad electrodes in a peripheral area outside the display area; a first organic insulating layer comprising an opening overlapping the plurality of pad electrodes; and an integrated circuit overlapping the plurality of pad electrodes and electrically connected to the plurality of pad electrodes, wherein a distance between an edge of the first organic insulating layer defining the opening and an edge of the integrated circuit is 40 micrometers (μm) or more.

    DISPLAY APPARATUS
    3.
    发明申请

    公开(公告)号:US20220013620A1

    公开(公告)日:2022-01-13

    申请号:US17369188

    申请日:2021-07-07

    Abstract: A display apparatus having a display panel that includes a first pad portion is provided. A flexible printed circuit board is configured to attach to the display panel. The flexible printed circuit board includes a second pad portion that is configured to electrically connect to the first pad portion. The first pad portion includes a plurality of first signal pads, a first test pad, and a first alignment pad having a first shape. The second pad portion comprises a second alignment pad having a second shape. The second alignment pad includes a first portion and a second portion that are spaced apart from each other. The first shape and the second shape are configured to form a predetermined alignment mark when the flexible printed circuit board is attached to the display panel at a predetermined position.

    Display device
    4.
    发明授权

    公开(公告)号:US12274142B2

    公开(公告)日:2025-04-08

    申请号:US18663051

    申请日:2024-05-13

    Abstract: A display device includes: a display area having a plurality of sub-pixels; a plurality of pad electrodes in a peripheral area outside the display area; a first organic insulating layer comprising an opening overlapping the plurality of pad electrodes; and an integrated circuit overlapping the plurality of pad electrodes and electrically connected to the plurality of pad electrodes, wherein a distance between an edge of the first organic insulating layer defining the opening and an edge of the integrated circuit is 40 micrometers (μm) or more.

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