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1.
公开(公告)号:US12156444B2
公开(公告)日:2024-11-26
申请号:US17447046
申请日:2021-09-07
Applicant: Samsung Display Co., Ltd.
Inventor: Shinhyuk Yang , Donghan Kang , Soonwook Hong , Yujin Kim , Jeehoon Kim , Hanhee Yoon
IPC: H10K50/84 , H10K59/12 , H10K59/13 , H10K59/131 , H10K50/844 , H10K59/121
Abstract: A display apparatus includes: a substrate including a display area, and a peripheral area; and a pad unit at the peripheral area, the pad unit including: a first conductive layer; a second conductive layer on the first conductive layer, and having a first opening; a third conductive layer on the second conductive layer, and having a second opening overlapping with the first opening, the second opening having an area less than an area of the first opening at a top surface of the second conductive layer; an organic protective layer filling the first opening, and having a third opening overlapping with the second opening; and an additional metal layer covering a top surface of the first conductive layer exposed through the first opening, an inner surface of the second opening, an inner surface of the third opening, and a portion of a top surface of the third conductive layer.
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公开(公告)号:US20220181427A1
公开(公告)日:2022-06-09
申请号:US17447046
申请日:2021-09-07
Applicant: Samsung Display Co., Ltd.
Inventor: Shinhyuk Yang , Donghan Kang , Soonwook Hong , Yujin Kim , Jeehoon Kim , Hanhee Yoon
IPC: H01L27/32
Abstract: A display apparatus includes: a substrate including a display area, and a peripheral area; and a pad unit at the peripheral area, the pad unit including: a first conductive layer; a second conductive layer on the first conductive layer, and having a first opening; a third conductive layer on the second conductive layer, and having a second opening overlapping with the first opening, the second opening having an area less than an area of the first opening at a top surface of the second conductive layer; an organic protective layer filling the first opening, and having a third opening overlapping with the second opening; and an additional metal layer covering a top surface of the first conductive layer exposed through the first opening, an inner surface of the second opening, an inner surface of the third opening, and a portion of a top surface of the third conductive layer.
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