公开(公告)号：US20150239066A1

公开(公告)日：2015-08-27

申请号：US14330421

申请日：2014-07-14

Applicant: Samsung Display Co., Ltd.

Inventor： Tae-Hyun Sung ,  Hyun-Gu Lee ,  Young-Gu Kim ,  Jeong-Il Oh

IPC: B23K26/40

CPC classification number: B23K26/40 ,  B23K26/0613 ,  B23K26/38 ,  B23K2103/172

Abstract: A substrate cutting apparatus and a method of manufacturing a display apparatus by using the substrate cutting apparatus, so that an occurrence of an error in cutting a substrate may be prevented and the substrate may be exactly cut. The substrate cutting apparatus includes an integrated laser beam oscillator where an infrared wavelength laser beam oscillator and a short pulse laser beam oscillator are adjacent to each other and are fixed; a stage on which a substrate is disposed; and a transfer unit that transfers at least one of the substrate and the integrated laser beam oscillator so as to control a short pulse laser beam to be irradiated on a region of the substrate, on which an infrared wavelength laser beam emitted from the integrated laser beam oscillator has just been irradiated.

Abstract translation: 一种基板切割装置和通过使用基板切割装置制造显示装置的方法，从而可以防止在切割基板时发生错误，并且可以精确地切割基板。 基板切割装置包括集成的激光束振荡器，其中红外波长激光束振荡器和短脉冲激光束振荡器彼此相邻并被固定; 设置基板的阶段; 以及传送单元，其传送所述基板和所述一体化激光束振荡器中的至少一个，以便控制在所述基板的区域上照射的短脉冲激光束，所述基板的一部分从所述一体化激光束 振荡器刚被照射。

公开(公告)号：US10137532B2

公开(公告)日：2018-11-27

申请号：US14330421

申请日：2014-07-14

Applicant: Samsung Display Co., Ltd.

Inventor： Tae-Hyun Sung ,  Hyun-Gu Lee ,  Young-Gu Kim ,  Jeong-Il Oh

IPC: B23K26/40 ,  B23K26/06 ,  B23K26/38 ,  B23K103/16

Abstract: A substrate cutting apparatus and a method of manufacturing a display apparatus by using the substrate cutting apparatus, so that an occurrence of an error in cutting a substrate may be prevented and the substrate may be exactly cut. The substrate cutting apparatus includes an integrated laser beam oscillator where an infrared wavelength laser beam oscillator and a short pulse laser beam oscillator are adjacent to each other and are fixed; a stage on which a substrate is disposed; and a transfer unit that transfers at least one of the substrate and the integrated laser beam oscillator so as to control a short pulse laser beam to be irradiated on a region of the substrate, on which an infrared wavelength laser beam emitted from the integrated laser beam oscillator has just been irradiated.