公开(公告)号：US10020632B2

公开(公告)日：2018-07-10

申请号：US15322737

申请日：2015-07-03

申请人： AMPLITUDE SYSTEMES

发明人： Antoine Courjaud

IPC分类号： G02F1/35 ,  G02F2/02 ,  H01S3/23 ,  H01S3/067 ,  H01S3/00 ,  B23K26/0622 ,  B23K26/06 ,  H01S3/16

CPC分类号： H01S3/2391 ,  B23K26/0608 ,  B23K26/0613 ,  B23K26/0624 ,  H01S3/005 ,  H01S3/0092 ,  H01S3/067 ,  H01S3/06754 ,  H01S3/1608 ,  H01S3/1618 ,  H01S3/2308

摘要： Disclosed is a UV-visible laser system having ultrashort pulses with high power and/or high energy. The laser system includes at least one non-linear optical crystal (1) adapted for receiving two distinct ultrashort laser pulses (31, 32) in the visible or infrared domain emitted respectively by two distinct laser pulse sources (11, 12) and a temporal synchronization unit (41, 42) adapted so that the two ultrashort laser pulses (31, 32) are superimposed in time and space in the non-linear optical crystal (1) with any phase shift, and generate, by sum frequency, an ultrashort laser pulse (131) having an optical frequency equal to the sum of the respective optical frequencies of the two distinct laser pulses (31, 32).

公开(公告)号：US20180001425A1

公开(公告)日：2018-01-04

申请号：US15708628

申请日：2017-09-19

申请人： IPG Photonics Corporation

发明人： Jeffrey P. SERCEL ,  Marco MENDES ,  Rouzbeh SARRAFI ,  Joshua SCHOENLY ,  Xiangyang SONG ,  Mathew HANNON ,  Miroslaw SOKOL

IPC分类号： B23K26/402 ,  B23K26/70 ,  C03B33/02 ,  B23K26/38 ,  B23K103/00

CPC分类号： B23K26/402 ,  B23K26/0613 ,  B23K26/0624 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/0876 ,  B23K26/361 ,  B23K26/38 ,  B23K26/70 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  C03B33/0222 ,  Y02P40/57

摘要： Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

公开(公告)号：US09839976B2

公开(公告)日：2017-12-12

申请号：US14533997

申请日：2014-11-05

申请人： Applied Materials, Inc.

发明人： Dean Jennings ,  Haifan Liang ,  Mark Yam ,  Vijay Parihar ,  Abhilash J. Mayur ,  Aaron Muir Hunter ,  Bruce E. Adams ,  Joseph Michael Ranish

IPC分类号： B23K26/06 ,  H01L21/268 ,  B23K26/00 ,  B23K26/073 ,  H01L21/324 ,  H01L21/20

CPC分类号： B23K26/0608 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/073 ,  B23K26/0732 ,  B23K26/0736 ,  B23K26/0738 ,  B23K26/352 ,  H01L21/02675 ,  H01L21/2026 ,  H01L21/268 ,  H01L21/324

摘要： A thermal processing apparatus and method in which a first laser source, for example, a CO2 emitting at 10.6 μm is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

公开(公告)号：US20170304941A1

公开(公告)日：2017-10-26

申请号：US15517705

申请日：2015-09-08

申请人： AMADA HOLDINGS CO., LTD.

发明人： Kaori USUDA

IPC分类号： B23K26/06 ,  B23K26/38 ,  B23K26/14

CPC分类号： B23K26/0617 ,  B23K26/0613 ,  B23K26/0876 ,  B23K26/14 ,  B23K26/38

摘要： A direct diode laser processing apparatus includes a laser oscillator that emits a multiple-wavelength laser beam, a transmission fiber that transmits the multiple-wavelength laser beam emitted from the laser oscillator, and a laser processing machine that condenses the multiple-wavelength laser beam transmitted through the transmission fiber and processes a workpiece. According to chromatic aberrations of the multiple-wavelength laser beam and the wavelength dependence of emissivity of the workpiece, a light intensity distribution of the multiple-wavelength laser beam in a thickness direction of the workpiece is provided with a plurality of peaks.

公开(公告)号：US20170291844A1

公开(公告)日：2017-10-12

申请号：US15585305

申请日：2017-05-03

申请人： Corning Incorporated

发明人： Sasha Marjanovic ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC分类号： C03B33/02 ,  B32B17/06 ,  B23K26/0622 ,  B23K26/40 ,  B23K26/00 ,  B23K26/073

CPC分类号： C03B33/0222 ,  B23K26/0006 ,  B23K26/0613 ,  B23K26/0624 ,  B23K26/0738 ,  B23K26/40 ,  B23K26/53 ,  B23K26/55 ,  B23K2103/50 ,  B32B17/06 ,  B32B2250/02 ,  B32B2315/02 ,  Y02P40/57 ,  Y10T428/21 ,  Y10T428/24273 ,  Y10T428/24355

摘要： A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.

公开(公告)号：US20170141530A1

公开(公告)日：2017-05-18

申请号：US15322737

申请日：2015-07-03

申请人： AMPLITUDE SYSTEMES

发明人： Antoine COURJAUD

IPC分类号： H01S3/23 ,  H01S3/067 ,  H01S3/00

CPC分类号： H01S3/2391 ,  B23K26/0608 ,  B23K26/0613 ,  B23K26/0624 ,  H01S3/005 ,  H01S3/0092 ,  H01S3/067 ,  H01S3/06754 ,  H01S3/1608 ,  H01S3/1618 ,  H01S3/2308

摘要： Disclosed is a UV-visible laser system having ultrashort pulses with high power and/or high energy. The laser system includes at least one non-linear optical crystal (1) adapted for receiving two distinct ultrashort laser pulses (31, 32) in the visible or infrared domain emitted respectively by two distinct laser pulse sources (11, 12) and a temporal synchronisation unit (41, 42) adapted so that the two ultrashort laser pulses (31, 32) are superimposed in time and space in the non-linear optical crystal (1) with any phase shift, and generate, by sum frequency, an ultrashort laser pulse (131) having an optical frequency equal to the sum of the respective optical frequencies of the two distinct laser pulses (31, 32).

公开(公告)号：US20160344162A1

公开(公告)日：2016-11-24

申请号：US15112598

申请日：2015-01-22

申请人： MITSUBISHI ELECTRIC CORPORATION

发明人： Susumu KONNO ,  Masato KAWASAKI ,  Daiji MORITA ,  Tomotaka KATSURA ,  Shuichi FUJIKAWA

IPC分类号： H01S5/40 ,  H01S3/08 ,  H01S5/0683 ,  H01S5/14

CPC分类号： H01S5/4012 ,  B23K26/0613 ,  B23K26/705 ,  C03B23/20 ,  H01S3/08059 ,  H01S5/06825 ,  H01S5/0683 ,  H01S5/14 ,  H01S5/143 ,  H01S5/4025 ,  H01S5/4062 ,  H01S5/4087

摘要： A beam combining device causing beams from a plurality of light sources and one or a plurality of spare light sources to enter a beam combining optical system, and to be combined and output after passing through a beam combining element. The beam combining device is configured to: detect a failure in the plurality of light sources; and move at least a part of the respective light sources, the spare light source, and the beam combining optical system, to cause a beam to enter the beam combining optical system from the spare light source instead of a beam from the failed light source, and to cause the beam to be combined to beams from the plurality of light sources on an optical path after the beam combining element.

摘要翻译： 一种光束组合装置，其使得来自多个光源的光束和一个或多个备用光源进入光束组合光学系统，并且在通过光束组合元件之后被组合和输出。 所述光束组合装置被配置为：检测所述多个光源中的故障; 并且移动各个光源，备用光源和光束组合光学系统的至少一部分，以使光束从备用光源而不是来自故障光源的光束进入光束组合光学系统， 并且使光束在光束组合元件之后的光路上组合成来自多个光源的光束。

公开(公告)号：US20150348781A1

公开(公告)日：2015-12-03

申请号：US14732920

申请日：2015-06-08

申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

发明人： Ryusuke KAWAKAMI ,  Kenichiro NISHIDA ,  Norihito KAWAGUCHI ,  Miyuki MASAKI ,  Atsushi YOSHINOUCHI

IPC分类号： H01L21/02 ,  H01L27/12 ,  H01L21/268

CPC分类号： H01L21/02675 ,  B23K26/0613 ,  B23K26/0732 ,  H01L21/0268 ,  H01L21/02691 ,  H01L21/268 ,  H01L27/1285 ,  H01L27/1296

摘要： A laser annealing method for executing laser annealing by irradiating a semiconductor film formed on a surface of a substrate with a laser beam, the method including the steps of, generating a linearly polarized rectangular laser beam whose cross section perpendicular to an advancing direction is a rectangle with an electric field directed toward a long-side direction of the rectangle or an elliptically polarized rectangular laser beam having a major axis directed toward a long-side direction, causing the rectangular laser beam to be introduced to the surface of the substrate, and setting a wavelength of the rectangular laser beam to a length which is about a desired size of a crystal grain in a standing wave direction.

摘要翻译： 一种激光退火方法，用于通过用激光束照射形成在衬底的表面上的半导体膜来执行激光退火，所述方法包括以下步骤：产生线性偏振矩形激光束，其垂直于前进方向的截面为矩形 具有朝向矩形的长边方向的电场或具有指向长边方向的长轴的椭圆偏振矩形激光束，使矩形激光束被引入到基板的表面，并且设定 矩形激光束的波长长度大约为驻波方向的晶粒的期望尺寸。

公开(公告)号：US09187318B2

公开(公告)日：2015-11-17

申请号：US13824634

申请日：2011-09-15

申请人： Xuanming Duan ,  Shu Chen ,  Hongzhong Cao ,  Xianzi Dong ,  Zhensheng Zhao

发明人： Xuanming Duan ,  Shu Chen ,  Hongzhong Cao ,  Xianzi Dong ,  Zhensheng Zhao

IPC分类号： H01L21/00 ,  B81C1/00 ,  B23K26/06 ,  B23K26/067 ,  B23K26/08 ,  H01L21/02 ,  G03F7/20

CPC分类号： B23K26/0624 ,  B23K26/048 ,  B23K26/0613 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/0676 ,  B81C1/00428 ,  G03F7/2053 ,  G03F7/70375 ,  H01L21/02107

摘要： A laser micro/nano processing system (100, 200, 300, 400) comprises: a laser light source used to provide a first laser beam having a first wavelength and a second laser beam having a second wavelength different from the first wavelength, with the pulse width of the first laser beam being in the range from a nanosecond to a femtosecond; an optical focusing assembly used to focus the first laser beam and the second laser beam to the same focal point; and a micro mobile platform (21) controlled by a computer. Also disclosed are a method for micro/nano-processing photosensitive materials with a laser and a method for fabricating a device with a micro/nano structure using laser two-photon direct writing technology. In the system and methods, spatial and temporal overlapping of two laser beams is utilized, so as to obtain a micro/nano structure with a processing resolution higher than that of a single laser beam, using an average power lower than that of a single laser beam.

摘要翻译： 激光微/纳米处理系统（100,200,300,400）包括：激光源，用于提供具有第一波长的第一激光束和具有不同于第一波长的第二波长的第二激光束，其中 第一激光束的脉冲宽度在从纳秒到飞秒的范围内; 用于将第一激光束和第二激光束聚焦到同一焦点的光学聚焦组件; 和由计算机控制的微型移动平台（21）。 还公开了一种用于具有激光的微/纳米处理感光材料的方法和使用激光双光子直写技术制造具有微/纳米结构的器件的方法。 在系统和方法中，利用两个激光束的空间和时间重叠，以获得具有比单个激光束高的处理分辨率的微/纳米结构，使用比单个激光器的平均功率更低的平均功率 光束。

公开(公告)号：US20150321286A1

公开(公告)日：2015-11-12

申请号：US14648046

申请日：2013-11-29

申请人： DIRECTPHOTONICS INDUSTRIES

发明人： Stefan Heinemann ,  Haro Fritsche ,  Bastian Kruschke ,  Wolfgang Gries ,  Fabio Ferrario ,  Ralf Koch

IPC分类号： B23K26/06 ,  B23K26/34

CPC分类号： B23K26/0604 ,  B23K26/0608 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0643 ,  B23K26/073 ,  B23K26/34

摘要： The invention discloses a device for laser material machining, with at least two laser beam sources (2a-2c) which emit laser beams (5a-5c) of different wavelengths, with associated beam imaging means (3a-3c), to configure appropriately the beam paths of each associated laser beam (5a-5c), a beam superposition device (6), to overlay the laser beams (5a-5c) on each other, and imaging optics (8), to image the overlaid laser beams (5a-5c) onto a workpiece (12) so that respective focal points are associated with the laser beams (5a-5c) in the focus of the imaging optics (8) on the workpiece (12), wherein the beam imaging means image the laser beams (5a-5c) onto the respective focal points in a predefined arrangement which can be varied by means of the beam imaging means (3a-3c). According to the invention, electronic control devices (4a-4c) are provided which are able to vary each of the outputs of the laser beams (5a-5c) with a high frequency to vary the intensities of the respective focal points at the focus of the imaging optics (8) in a predefined manner. In this way, a high frequency control of the parameters of laser material machining which can be combined with conventional modulation techniques is implemented.

摘要翻译： 本发明公开了一种用于激光材料加工的装置，其中至少两个用相关联的光束成像装置（3a-3c）发射不同波长的激光束（5a-5c）的激光束源（2a-2c）适当地配置 每个相关联的激光束（5a-5c）的光束路径，用于将激光束（5a-5c）彼此覆盖的光束叠加装置（6），以及成像光学元件（8），以将重叠的激光束（5a -5c）到工件（12）上，使得各个焦点与在工件（12）上的成像光学器件（8）的焦点处的激光束（5a-5c）相关联，其中光束成像装置对激光成像 光束（5a-5c）以预定的布置方式放置到各个焦点上，该布置可以通过光束成像装置（3a-3c）而改变。 根据本发明，提供了能够以高频率改变激光束（5a-5c）的每个输出的电子控制装置（4a-4c），以改变在焦点处的各个焦点的强度 成像光学器件（8）。 以这种方式，实现了可以与常规调制技术组合的激光材料加工参数的高频控制。