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公开(公告)号:US20220403179A1
公开(公告)日:2022-12-22
申请号:US17805008
申请日:2022-06-01
发明人: Sunghwan Hong , Beomsoo Shin , Sukhoon Kang , Jeongsoo Kim , Jongmin Ok , Minseok Lee
IPC分类号: C09D4/00 , C08F220/06 , H01L27/32
摘要: A photosensitive resin composition and an electronic apparatus including the same are provided. The photosensitive resin composition includes: a first unit including one or more acryloyl groups, a second unit including one or more epoxy groups, and a third unit including at least one hydrophilic group, wherein a ratio of the equivalent weight of the acryloyl group to the equivalent weight of the epoxy group is 2:1 or more.