METHOD OF FABRICATING ELECTRONIC DEVICE INCLUDING A SENSOR MODULE

    公开(公告)号:US20230290175A1

    公开(公告)日:2023-09-14

    申请号:US17991162

    申请日:2022-11-21

    CPC classification number: G06V40/1306 H01L27/3234 H01L51/56

    Abstract: A method of fabricating an electronic device includes: fabricating a display module including a display panel, a protection film disposed on the display panel, and a cover panel disposed on the protection film, wherein the cover panel has an open portion partially exposing the protection film; forming a first resin on a first region of the open portion; forming a second resin on a second region; emitting a first UV ray to the first and second resins; placing a sensor module on the first resin; pressing the sensor module such that the first and second resins fill the first and second regions and a first filling layer and a second filling layer in the first region and the second region, respectively, are formed; and emitting a second UV ray to the second filling layer in the second region to cure the second filling layer.

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