公开(公告)号：US20230098923A1

公开(公告)日：2023-03-30

申请号：US17951096

申请日：2022-09-23

Applicant: Samsung Display Co., Ltd.

Inventor： SEONG-YONG HWANG ,  SHINYA ONOUE ,  DONGJIN JEONG

IPC: H01L51/52 ,  H01Q1/24 ,  H01L27/32

Abstract: A display device includes a display panel and a first shielding layer. The display panel includes a substrate, a display structure, and a sensing structure. The substrate includes a display area, a bending area, and a pad area. The display structure is disposed in the display area on the substrate. The sensing structure is disposed on the display structure, and includes sensing electrodes. The first shielding layer is disposed in the bending area on the substrate, and includes a same material as the sensing electrode.

公开(公告)号：US20230290175A1

公开(公告)日：2023-09-14

申请号：US17991162

申请日：2022-11-21

Applicant: Samsung Display Co., Ltd.

Inventor： SHINYA ONOUE ,  Dongjin Jeong ,  Jin Hyun

IPC: G06V40/13 ,  H10K59/65 ,  H10K71/00

CPC classification number: G06V40/1306 ,  H01L27/3234 ,  H01L51/56

Abstract: A method of fabricating an electronic device includes: fabricating a display module including a display panel, a protection film disposed on the display panel, and a cover panel disposed on the protection film, wherein the cover panel has an open portion partially exposing the protection film; forming a first resin on a first region of the open portion; forming a second resin on a second region; emitting a first UV ray to the first and second resins; placing a sensor module on the first resin; pressing the sensor module such that the first and second resins fill the first and second regions and a first filling layer and a second filling layer in the first region and the second region, respectively, are formed; and emitting a second UV ray to the second filling layer in the second region to cure the second filling layer.

公开(公告)号：US20240237224A9

公开(公告)日：2024-07-11

申请号：US18231289

申请日：2023-08-08

Applicant: Samsung Display Co., LTD.

Inventor： SHINYA ONOUE ,  EUNJOONG MUN ,  HYEON DEUK HWANG ,  JUNGWOOK KIM ,  HEECHANG KIM ,  Kyounghee PARK ,  JIYUN BANG

IPC: H05K3/00 ,  H05K1/02 ,  H05K1/05 ,  H05K3/12

CPC classification number: H05K3/0014 ,  H05K1/0274 ,  H05K1/056 ,  H05K3/125 ,  H05K3/1283 ,  H05K2201/10128

Abstract: A method of manufacturing an electronic device includes providing a mold with a first opening defined therein and including a projection portion disposed in the first opening, forming, in the first opening, a first layer including a first material through an inkjet printing method, disposing the mold on a display panel in a way such that the first opening faces the display panel, and forming a display module by removing the mold. The display module is provided with a second opening defined therein and corresponding to the projection portion.

公开(公告)号：US20240138072A1

公开(公告)日：2024-04-25

申请号：US18231289

申请日：2023-08-07

Applicant: Samsung Display Co., LTD.

Inventor： SHINYA ONOUE ,  EUNJOONG MUN ,  HYEON DEUK HWANG ,  JUNGWOOK KIM ,  HEECHANG KIM ,  Kyounghee PARK ,  JIYUN BANG

IPC: H05K3/00 ,  H05K1/02 ,  H05K1/05 ,  H05K3/12

CPC classification number: H05K3/0014 ,  H05K1/0274 ,  H05K1/056 ,  H05K3/125 ,  H05K3/1283 ,  H05K2201/10128

Abstract: A method of manufacturing an electronic device includes providing a mold with a first opening defined therein and including a projection portion disposed in the first opening, forming, in the first opening, a first layer including a first material through an inkjet printing method, disposing the mold on a display panel in a way such that the first opening faces the display panel, and forming a display module by removing the mold. The display module is provided with a second opening defined therein and corresponding to the projection portion.