公开(公告)号：US12269140B2

公开(公告)日：2025-04-08

申请号：US16411141

申请日：2019-05-14

Applicant: Samsung Display Co., Ltd.

Inventor： Seungbae Kang ,  Joon-hwa Bae ,  Heesung Yang ,  Woojin Cho ,  Byoungkwon Choo

IPC: B24B7/24 ,  B24B27/00 ,  B24B29/02 ,  B24B37/04 ,  B24B41/047

Abstract: A substrate polishing apparatus including a stage configured to load a substrate, the stage having a flat surface, which is parallel to a first direction and a second direction, and on which the substrate is loaded, a pressing unit configured to exert a pressure on the substrate in a third direction, a rotary unit configured to revolve the pressing unit around a central axis parallel to the third direction, when viewed in a plan view, a plurality of polishing pads provided between the pressing unit and the substrate to be in contact with the substrate, and a nozzle part configured to supply a slurry onto the substrate. The polishing pads may be spaced apart from each other in a direction and may have a rectangular shape in the plan view.