SUBSTRATE PEELING DEVICE AND METHOD FOR PEELING SUBSTRATE
    1.
    发明申请
    SUBSTRATE PEELING DEVICE AND METHOD FOR PEELING SUBSTRATE 审中-公开
    基板剥离装置和用于剥离基板的方法

    公开(公告)号:US20150217556A1

    公开(公告)日:2015-08-06

    申请号:US14303364

    申请日:2014-06-12

    Abstract: A substrate peeling device including an attachment/detachment unit attached to a first substrate and a second substrate, which is coupled to the first substrate, to peel the second substrate, a sensing unit configured to sense a speed at which the first substrate and the second substrate are peeled by the attachment/detachment unit, and a control unit configured to control the attachment/detachment unit to constantly maintain an angle at which the first substrate and the second substrate are peeled.

    Abstract translation: 一种基板剥离装置,包括附接到第一基板的附接/拆卸单元和耦合到第一基板的第二基板以剥离第二基板;感测单元,被配置为感测第一基板和第二基板的速度 基板由安装/拆卸单元剥离,以及控制单元,其被配置为控制安装/拆卸单元以恒定地保持第一基板和第二基板被剥离的角度。

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