Display device
    2.
    发明授权

    公开(公告)号:US11569335B2

    公开(公告)日:2023-01-31

    申请号:US17145273

    申请日:2021-01-08

    IPC分类号: H01L27/32 H01L29/45 H01L51/52

    摘要: A display device is disclosed. In one aspect, the device includes a substrate and a display unit disposed on the substrate and including a plurality of pixels each pixel including a thin film transistor, a display element electrically connected to the thin film transistor, and a planarization layer interposed between the thin film transistor and the display element. The display unit includes a display region and a non-display region surrounding the display region, wherein the non-display region includes a voltage line. The planarization layer comprises a central portion, an outer portion and a dividing region interposed between the central and outer portions, wherein the dividing region is located in the non-display region. The planarization layer covers at least a lateral side of the voltage line formed in the dividing region.

    DISPLAY DEVICE
    3.
    发明申请

    公开(公告)号:US20210143245A1

    公开(公告)日:2021-05-13

    申请号:US17145273

    申请日:2021-01-08

    IPC分类号: H01L27/32 H01L29/45 H01L51/52

    摘要: A display device is disclosed. In one aspect, the device includes a substrate and a display unit disposed on the substrate and including a plurality of pixels each pixel including a thin film transistor, a display element electrically connected to the thin film transistor, and a planarization layer interposed between the thin film transistor and the display element. The display unit includes a display region and a non-display region surrounding the display region, wherein the non-display region includes a voltage line. The planarization layer comprises a central portion, an outer portion and a dividing region interposed between the central and outer portions, wherein the dividing region is located in the non-display region. The planarization layer covers at least a lateral side of the voltage line formed in the dividing region.

    ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20200152914A1

    公开(公告)日:2020-05-14

    申请号:US16744088

    申请日:2020-01-15

    IPC分类号: H01L51/52

    摘要: A method of manufacturing an organic light emitting diode (OLED) display device includes: providing a substrate including a display area and a non-display area; forming an organic light emitting diode element in the display area; forming a barrier wall around the display area and spaced apart from the organic light emitting diode element; performing a plasma treatment on the substrate on which the organic light emitting diode element is formed; and forming a thin film encapsulation layer for coating the organic light emitting diode element, wherein forming the thin film encapsulation layer includes: forming at least one inorganic layer; and forming at least one organic layer inwardly of the barrier wall.

    Organic light emitting diode device with barrier wall

    公开(公告)号:US10547028B2

    公开(公告)日:2020-01-28

    申请号:US14855337

    申请日:2015-09-15

    IPC分类号: H01L51/52 H01L51/56 H01L27/32

    摘要: A method of manufacturing an organic light emitting diode (OLED) display device includes: providing a substrate including a display area and a non-display area; forming an organic light emitting diode element in the display area; forming a barrier wall around the display area and spaced apart from the organic light emitting diode element; performing a plasma treatment on the substrate on which the organic light emitting diode element is formed; and forming a thin film encapsulation layer for coating the organic light emitting diode element, wherein forming the thin film encapsulation layer includes: forming at least one inorganic layer; and forming at least one organic layer inwardly of the barrier wall.

    ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20220238843A1

    公开(公告)日:2022-07-28

    申请号:US17723065

    申请日:2022-04-18

    IPC分类号: H01L51/52

    摘要: A method of manufacturing an organic light emitting diode (OLED) display device includes: providing a substrate including a display area and a non-display area; forming an organic light emitting diode element in the display area; forming a barrier wall around the display area and spaced apart from the organic light emitting diode element; performing a plasma treatment on the substrate on which the organic light emitting diode element is formed; and forming a thin film encapsulation layer for coating the organic light emitting diode element, wherein forming the thin film encapsulation layer includes: forming at least one inorganic layer; and forming at least one organic layer inwardly of the barrier wall.