摘要:
A photosensitive resin composition comprises about 10 wt % to about 50 wt % of a solute comprising about 100 parts by weight of an acryl-based copolymer and about 5 to about 100 parts by weight of a 1,2-quinonediazide compound; and a solvent comprising a glycol-based material having a boiling point of greater than about 190° C., wherein the acryl-based copolymer is a copolymer of an unsaturated carbonic acid or an anhydride thereof, an epoxy group-containing unsaturated compound, and an olefin-based unsaturated compound.