公开(公告)号：US20130168144A1

公开(公告)日：2013-07-04

申请号：US13717504

申请日：2012-12-17

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung Won Jeong ,  Seon Jae Mun ,  Boo Yang Jung ,  Dae Young Lee ,  Jin Won Choi

IPC: H05K3/40 ,  H05K1/02

CPC classification number: H05K3/4007 ,  H01L2924/0002 ,  H05K1/0296 ,  H05K3/4015 ,  H05K2201/099 ,  H05K2201/10242 ,  H01L2924/00

Abstract: The present invention relates to a method for manufacturing a printed circuit board, which includes: preparing a base substrate with an electrode pad; providing a conductive material having a predetermined height; disposing the conductive material on the electrode pad; and forming a conductive post on the electrode pad by bonding the electrode pad and the conductive material, and can achieve a fine pitch and easily implement a conductive post with a high aspect ratio.

Abstract translation: 印刷电路板的制造方法技术领域本发明涉及一种印刷电路板的制造方法，其特征在于，包括：准备具有电极焊盘的基板; 提供具有预定高度的导电材料; 将导电材料设置在电极焊盘上; 并且通过接合电极焊盘和导电材料在电极焊盘上形成导电柱，并且可以实现微细间距并容易地实现具有高纵横比的导电柱。