公开(公告)号：US20200097421A1

公开(公告)日：2020-03-26

申请号：US16200622

申请日：2018-11-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hien LE ,  Vikas Kumar SINHA ,  Craig Daniel EATON ,  Anushkumar RENGARAJAN ,  Matthew Derrick GARRETT

IPC: G06F13/16 ,  G06F1/12 ,  G06F12/0815

Abstract: According to one general aspect, an apparatus may include a processor coupled with a memory controller via a first path and a second path. The first path may traverse a coherent interconnect that couples the memory controller with a plurality of processors, including the processor. The second path may bypass the coherent interconnect and has a lower latency than the first path. The processor may be configured to send a memory access request to the memory controller and wherein the memory access request includes a path request to employ either the first path or the second path. The apparatus may include the memory controller configured to fulfill the memory access request and, based at least in part upon the path request, send at least part of the results of the memory access to the processor via either the first path or the second path.