公开(公告)号：US10833046B2

公开(公告)日：2020-11-10

申请号：US16058227

申请日：2018-08-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tea Geon Kim ,  Jung Lae Jung ,  Bub Ryong Lee

IPC: B23K37/04 ,  H01L23/00

Abstract: A stack tool comprises a lower jig having a plurality of package seating regions configured to seat a semiconductor package, an intermediate jig configured to be seated on top of the lower jig, and having a package support hole into which the semiconductor package is configured to be inserted, the intermediate jig having a shape corresponding to the plurality of package seating regions, and an upper dumbbell. The upper dumbbell includes a dumbbell main body on top of the intermediate jig, an upper recess stepped downward from an upper surface of the dumbbell main body on only a region corresponding to an upper surface of the semiconductor package, and a protruding support configured to protrude downward from a lower surface of the upper recess and configured to be brought into contact with an upper surface of the semiconductor package.