公开(公告)号：US10748855B2

公开(公告)日：2020-08-18

申请号：US15900284

申请日：2018-02-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tea-Geon Kim ,  Jung Lae Jung

IPC: H01L23/00 ,  B32B37/22 ,  H01L21/67 ,  H01L21/48 ,  B32B37/10 ,  H01L21/66 ,  H01L23/498

Abstract: A method of fabricating a semiconductor package using a laminating device is provided. The method includes placing a substrate on a substrate stand; providing a pressurizing unit which is expandable and includes a convex surface facing an upper surface of the substrate stand, on the substrate stand; injecting air into the pressurizing unit using a plate which is connected to the pressurizing unit; and supplying a film by a film supply unit which supplies the film between the substrate stand and the pressurizing unit, wherein the pressurizing unit attaches the film onto the substrate, while expanding.

公开(公告)号：US20190257734A1

公开(公告)日：2019-08-22

申请号：US16049099

申请日：2018-07-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung Lae Jung ,  Tea Geon Kim

IPC: G01N15/08 ,  B29C33/70

Abstract: A mold test apparatus includes a mold support plate having a top surface on which a mold is mounted, wherein the mold support plate includes a plurality of test suction pipes communicating with paths in the mold, vacuum pipes each having one end connected to one of the plurality of test suction pipes, a pump connected to the other end of the pipe, and at least one pressure sensor configured to measure a pressure of the vacuum pipe, wherein the paths communicate with adsorption holes provided in a top surface of the mold, and wherein the at least one pressure sensor includes a determining unit configured to determine whether the adsorption holes are clogged by using the measured pressure.

公开(公告)号：US10900883B2

公开(公告)日：2021-01-26

申请号：US16049099

申请日：2018-07-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung Lae Jung ,  Tea Geon Kim

IPC: G01N15/08 ,  B29C33/70 ,  H01L21/56

Abstract: A mold test apparatus includes a mold support plate having a top surface on which a mold is mounted, wherein the mold support plate includes a plurality of test suction pipes communicating with paths in the mold, vacuum pipes each having one end connected to one of the plurality of test suction pipes, a pump connected to the other end of the pipe, and at least one pressure sensor configured to measure a pressure of the vacuum pipe, wherein the paths communicate with adsorption holes provided in a top surface of the mold, and wherein the at least one pressure sensor includes a determining unit configured to determine whether the adsorption holes are clogged by using the measured pressure.

公开(公告)号：US10833046B2

公开(公告)日：2020-11-10

申请号：US16058227

申请日：2018-08-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tea Geon Kim ,  Jung Lae Jung ,  Bub Ryong Lee

IPC: B23K37/04 ,  H01L23/00

Abstract: A stack tool comprises a lower jig having a plurality of package seating regions configured to seat a semiconductor package, an intermediate jig configured to be seated on top of the lower jig, and having a package support hole into which the semiconductor package is configured to be inserted, the intermediate jig having a shape corresponding to the plurality of package seating regions, and an upper dumbbell. The upper dumbbell includes a dumbbell main body on top of the intermediate jig, an upper recess stepped downward from an upper surface of the dumbbell main body on only a region corresponding to an upper surface of the semiconductor package, and a protruding support configured to protrude downward from a lower surface of the upper recess and configured to be brought into contact with an upper surface of the semiconductor package.