公开(公告)号：US20230136210A1

公开(公告)日：2023-05-04

申请号：US17987343

申请日：2022-11-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungjoon KIM ,  Kyunghoon Moon ,  Heejin Park ,  Yongyoun Kim ,  Youngmi Jang ,  Eunseong Choi

IPC: H01Q1/52 ,  H01Q9/04 ,  H01Q1/24 ,  H01Q21/24

Abstract: An electronic device is provided. The electronic device includes: a first housing comprising a first support member facing in a first direction, a first rear cover facing in a second direction opposite the first direction, and a first side member surrounding a first space between the first support member and the first rear cover; a second housing; a hinge structure connected to the first housing and the second housing and configured to be folded about a folding axis; a first antenna structure disposed in the first space and configured to form a first electric field in the second direction; a second antenna structure disposed near the first antenna structure in the first space; and a conductive member disposed between the first antenna structure and the second antenna structure.

公开(公告)号：US20230344112A1

公开(公告)日：2023-10-26

申请号：US18214781

申请日：2023-06-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongsub LEE ,  Hyosuk YOO ,  Woojong JO ,  Byungjoon KIM

IPC: H01Q1/24 ,  H01Q21/00 ,  H04B7/06 ,  H01Q23/00

CPC classification number: H01Q1/243 ,  H01Q21/0025 ,  H04B7/06966 ,  H01Q23/00

Abstract: An electronic device includes a first antenna; a second antenna; a first front-end module configured to process a signal transmitted through the first antenna or the second antenna and process a signal received through the first antenna; a second front-end module configured to process a signal received through the second antenna; a first switch configured to connect the first front-end module to one of the first antenna or a first path; a second switch configured to connect the second antenna to one of the second front-end module or the first path; and a processor configured to, based on a communication signal being transmitted through the first antenna, control the first switch and the second switch to connect the first antenna to the first front-end module and connect the second antenna to the first path.

公开(公告)号：US20230352810A1

公开(公告)日：2023-11-02

申请号：US18219348

申请日：2023-07-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonseob KIM ,  Byungjoon KIM ,  Changwon JANG

IPC: H01Q1/22 ,  H01Q1/38 ,  H01Q21/06

CPC classification number: H01Q1/2283 ,  H01Q1/38 ,  H01Q21/065

Abstract: An antenna structure according to various embodiments is provided and may include a printed circuit board (PCB), a radio frequency integrated circuit (RFIC) disposed at a first surface of the PCB and a first antenna disposed at a second surface of the PCB, parallel to the first surface, and including a plurality of conductive patches. The antenna structure includes a dielectric layer adjacent to the second surface and arranged parallel to the second surface and a conductive layer disposed in the dielectric layer and including a plurality of openings formed in areas corresponding to the plurality of conductive patches, wherein the RFIC transmits/receives a signal having a specified frequency through the first antenna and the conductive layer.

公开(公告)号：US20200161763A1

公开(公告)日：2020-05-21

申请号：US16687881

申请日：2019-11-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongpil LEE ,  Byungjoon KIM ,  Wonseob KIM ,  Heejin PARK ,  Hyunchul HONG ,  Sungchul PARK

IPC: H01Q5/314 ,  H04B1/40 ,  H01Q21/06

Abstract: Disclosed herein is an electronic device. The electronic device may include an electronic device may comprising a housing, a first PCB disposed inside the housing, a first wireless communication circuit disposed on the first PCB to transmit and receive signals of a first frequency band, a second PCB disposed inside the housing, wherein the second PCB includes a signal line, an antenna array disposed on the second PCB, a second wireless communication circuit disposed on the second PCB to transmit and receive a signal of a second frequency band using the antenna array, and a conductive member electrically connected to the first wireless communication circuit by the signal line of the second PCB via a feed point for the conductive member.

公开(公告)号：US20250023230A1

公开(公告)日：2025-01-16

申请号：US18658094

申请日：2024-05-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sujin CHO ,  Kihwan KWON ,  Byungjoon KIM ,  Heejin PARK

IPC: H01Q3/06 ,  H01Q1/22

Abstract: An electronic device is provided. The electronic device includes a housing including a support, a printed circuit board disposed in the housing, at least one processor disposed on the printed circuit board, a first antenna module spaced apart from the printed circuit board in the housing, a flexible printed circuit board disposed in the housing, and coupled to the printed circuit board and the first antenna module, to electrically connect the printed circuit board and the first antenna module, a second antenna module disposed in the housing, and including a base substrate and a conductive pattern disposed on the base substrate, and a conductive sheet, wherein the flexible printed circuit board is at least partially overlapped with the second antenna module in a direction of a rear surface of the housing, between the printed circuit board and the first antenna module, and wherein at least a portion of the conductive sheet is disposed between the second antenna module and the flexible printed circuit board at a portion where the second antenna module and the flexible printed circuit board overlap.