公开(公告)号：US20240047858A1

公开(公告)日：2024-02-08

申请号：US18363273

申请日：2023-08-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sujin CHO ,  Woosung CHUN ,  Jongpil LEE ,  Jungchul AN ,  Soyoung LEE

IPC: H01Q1/24 ,  H01Q1/36 ,  H04M1/02

CPC classification number: H01Q1/243 ,  H01Q1/36 ,  H04M1/0214

Abstract: An electronic device is provided. The electronic device includes a first housing including a first plate, a second housing including a second plate, a display disposed on the first plate of the first housing and the second plate of the second housing, a hinge member that is disposed between the first housing and the second housing and that rotatably connects the first housing and the second housing, and an antenna module disposed in the first housing. The first plate includes an antenna seating portion on which the antenna module is seated. The antenna seating portion is formed between a first sidewall part and a second sidewall part that vertically extend from one surface of the first plate and face each other. The antenna module is disposed such that at least a portion faces the first sidewall part and the second sidewall part. The first sidewall part includes a bumpy structure.

公开(公告)号：US20200161763A1

公开(公告)日：2020-05-21

申请号：US16687881

申请日：2019-11-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongpil LEE ,  Byungjoon KIM ,  Wonseob KIM ,  Heejin PARK ,  Hyunchul HONG ,  Sungchul PARK

IPC: H01Q5/314 ,  H04B1/40 ,  H01Q21/06

Abstract: Disclosed herein is an electronic device. The electronic device may include an electronic device may comprising a housing, a first PCB disposed inside the housing, a first wireless communication circuit disposed on the first PCB to transmit and receive signals of a first frequency band, a second PCB disposed inside the housing, wherein the second PCB includes a signal line, an antenna array disposed on the second PCB, a second wireless communication circuit disposed on the second PCB to transmit and receive a signal of a second frequency band using the antenna array, and a conductive member electrically connected to the first wireless communication circuit by the signal line of the second PCB via a feed point for the conductive member.