公开(公告)号：US20240258347A1

公开(公告)日：2024-08-01

申请号：US18524723

申请日：2023-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byungjun PARK ,  Jieun KIM ,  Woojae JANG

IPC: H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/14645 ,  H01L27/14621

Abstract: An image sensor may include a first semiconductor chip including a pixel area and a peripheral area, the pixel area including a plurality of pixels, and a second semiconductor chip coupled to a lower surface of the first semiconductor chip, the second semiconductor chip including a plurality of logic elements, the pixel area including a plurality of color filters and a fence in the pixel area, the plurality of color filters corresponding to the plurality of pixels, the fence having a grid pattern, and each of the color filters of the plurality of color filters separated from each other by the fence, the peripheral area including a shield area and a shield outer area, the shield area surrounding the pixel area, and a fence insulating layer included in the shield outer area, the fence insulating layer including a same material as the fence.

公开(公告)号：US20210168336A1

公开(公告)日：2021-06-03

申请号：US17170008

申请日：2021-02-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Hoon KIM ,  Byungjun PARK

IPC: H04N9/04 ,  H04N5/374 ,  H04N5/357 ,  H04N5/378

Abstract: An image sensor is disclosed. The image sensor includes a substrate including an active region and a dummy region, a plurality of unit pixels on the active region, a transparent conductive layer on a first surface of the substrate, a light-blocking layer on the transparent conductive layer and electrically connected to the transparent conductive layer, the light-blocking layer having a grid structure adjacent light transmission regions, and a pad electrically connected to the light-blocking layer, on the dummy region.