公开(公告)号：US20250087570A1

公开(公告)日：2025-03-13

申请号：US18626700

申请日：2024-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： HYUNSOO CHUNG ,  KWANG-SOO KIM ,  CHI WOO LEE

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L25/065

Abstract: A semiconductor package includes a redistribution layer structure, a first sub-package positioned on the redistribution layer structure, a second sub-package positioned on the first sub-package, and a first encapsulant positioned on the first sub-package and encapsulating the second sub-package. The first sub-package includes a first semiconductor chip including a first chip through via and a dielectric through via electrically connected to the redistribution layer structure. The second sub-package includes a second semiconductor chip including a plurality of second chip through vias, each second chip through via electrically connected to one of the first chip through via and the dielectric through via, a third semiconductor chip positioned on the second semiconductor chip, and a fourth semiconductor chip positioned on the third semiconductor chip. Each of the second to fourth semiconductor chips is exposed at a side surface of the second sub-package and covered with the first encapsulant.

公开(公告)号：US20250096214A1

公开(公告)日：2025-03-20

申请号：US18626691

申请日：2024-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： HYUNSOO CHUNG ,  YOUNG LYONG KIM ,  CHI WOO LEE

IPC: H01L25/16 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H10B80/00

Abstract: An embodiment provides a semiconductor package including: a redistribution structure; an interconnection structure on the redistribution structure; a memory stacking structure disposed on the redistribution structure and including a buffer die and core dies stacked on the buffer die; a semiconductor die disposed on the buffer die and on the interconnection structure; and an optical engine disposed on the interconnection structure.

公开(公告)号：US20250096215A1

公开(公告)日：2025-03-20

申请号：US18626787

申请日：2024-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： HYUNSOO CHUNG ,  KWANG-SOO KIM ,  CHI WOO LEE

IPC: H01L25/16 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L23/498

Abstract: A semiconductor package includes a redistribution structure, a semiconductor die on the redistribution structure, one or more memory stacking structures disposed on the redistribution structure, wherein the one or more memory stacking structures and the semiconductor die are arranged side by side on the redistribution structure, an optical engine disposed on the redistribution structure, wherein the optical engine and the semiconductor die are arranged side by side on the redistribution structure, and a heat dissipation structure on the semiconductor die, the one or more memory stacking structures, and the optical engine, wherein levels of upper surfaces of the semiconductor die, the one or more memory stacking structures, and the optical engine are the same.