公开(公告)号：US20240001408A1

公开(公告)日：2024-01-04

申请号：US18217815

申请日：2023-07-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dae-Woong CHOI ,  Yong Myung JUN ,  Hyun-Chul KIM ,  Chang Seok SEO ,  Chan JEON ,  Woo Seok CHOE ,  In Sung HUH

IPC: B08B3/02 ,  H01L21/687 ,  B08B3/08 ,  B08B5/02 ,  B08B13/00

CPC classification number: B08B3/02 ,  H01L21/68707 ,  B08B3/08 ,  B08B5/02 ,  B08B13/00 ,  F26B5/005

Abstract: An apparatus for manufacturing a semiconductor device, including: a wet treatment chamber; a nozzle provided in the wet treatment chamber and configured to spray a treatment material onto a substrate; a supercritical fluid treatment chamber configured to supply a supercritical fluid onto the substrate to treat the substrate; a transfer device comprising an arm configured to transfer the substrate between the wet treatment chamber and the supercritical fluid treatment chamber; and a controller configured to control the wet treatment chamber to spray the treatment material onto the arm