Abstract:
An apparatus for manufacturing a semiconductor device, including: a wet treatment chamber; a nozzle provided in the wet treatment chamber and configured to spray a treatment material onto a substrate; a supercritical fluid treatment chamber configured to supply a supercritical fluid onto the substrate to treat the substrate; a transfer device comprising an arm configured to transfer the substrate between the wet treatment chamber and the supercritical fluid treatment chamber; and a controller configured to control the wet treatment chamber to spray the treatment material onto the arm
Abstract:
A cover of an electronic device is provided. The cover includes a rear cover mounted on a rear surface of the electronic device, and a cover comprising a plurality of keys and is detachably coupled to the rear cover, wherein the cover is coupled to face one of a front surface and a rear surface of the rear cover. The cover comprises one or more mechanically operated switch members. The cover of the electronic device may be implemented according to various embodiments of the present disclosure.
Abstract:
A device isolation layer of the memory device includes a first insulation layer in a lower portion of a device isolation trench, a second insulation layer in an upper portion of the device isolation trench and a separation layer between the first insulation layer and the second insulation layer. First and second conductive fillers are in the first and second insulation layers and are separated by the separation layer.
Abstract:
In a method of inspecting a surface of a substrate, a first surface image of the substrate before loaded into a process chamber may be obtained. The first surface image may be processed to detect a defect on the surface of the substrate. Thus, the surfaces of all of the substrate may be inspected during a process may be performed without transferring the substrates.
Abstract:
A device isolation layer of the memory device includes a first insulation layer in a lower portion of a device isolation trench, a second insulation layer in an upper portion of the device isolation trench and a separation layer between the first insulation layer and the second insulation layer. First and second conductive fillers are in the first and second insulation layers and are separated by the separation layer.
Abstract:
A protection cover is provided, which includes a first cover that is foldable, a first electronic device being attachable to or detachable from the first cover; a second cover that is connected to the first cover so as to be foldable, a second electronic device being attachable to or detachable from the second cover, and a third cover that is connected to the first cover so as to be foldable.
Abstract:
A protective cover may include a first cover part configured to be opened to expose a front surface of the electronic device and to be closed to conceal the front surface of the electronic device; a second cover part rotatably coupled to the first cover part and detachably arranged on a rear surface of the electronic device; and an input device detachably provided in the first cover part.