Abstract:
A method of preventing program-disturbances for a non-volatile semiconductor memory device having a plurality of memory cells of which each includes a selection transistor and a memory transistor coupled in series between a bit-line and a common source-line is provided. First non-selected memory cells that share a first selection-line with a selected memory cell, and second non-selected memory cells that do not share the first selection-line with the selected memory cell are determined when the selected memory cell is selected to be programmed among the memory cells. A negative voltage is applied to second selection-lines that are coupled to the second non-selected memory cells when the selected memory cell is programmed by applying a positive voltage to the first selection-line that is coupled to the selected memory cell.
Abstract:
In a nonvolatile memory device and a method for fabricating the same, a device comprises a substrate, a trench in the substrate and a first gate pattern comprising a first bottom gate electrode having a first portion in the trench and having a second portion on the first portion and protruding in an upward direction relative to an upper surface of the substrate. A second gate pattern comprising a second gate electrode is on the substrate at a side of the first gate pattern and insulated from the first gate pattern. An impurity region is present in the substrate at a side of the first gate pattern opposite the second gate pattern, and overlapping part of the trench.