公开(公告)号：US10193250B2

公开(公告)日：2019-01-29

申请号：US15666745

申请日：2017-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Che-heung Kim ,  Chang-sik Kim ,  Seong-woon Booh

IPC: H01R12/57 ,  H05K7/14 ,  H01R12/70 ,  H01L25/07 ,  H02M7/00

Abstract: According to example embodiments, a substrate for a power module includes a first part, a second part, and a third part on a same surface of an underlying part of the substrate. The first part, the second part, and the third part may be spaced apart from each other, electrically insulated from each other, and not directly contacting each other. The third part may surround the first part and the second part. A first element module may be on the third part. The first part, the second part, and the third part may be conductive.