公开(公告)号：US20250093594A1

公开(公告)日：2025-03-20

申请号：US18747906

申请日：2024-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghoon Kang ,  Daegon Kim

IPC: G02B6/42 ,  H01L23/00 ,  H01L23/13 ,  H01L23/48 ,  H01L23/498 ,  H01L23/538 ,  H01L25/16 ,  H01L27/144

Abstract: A semiconductor package includes a package substrate including an alignment hole extending inwardly from a side surface of the package substrate, a photonic integrated circuit chip disposed on the package substrate, the of the package substrate chip including a groove extending inwardly from a side surface of the PIC chip and a photo-electron conversion unit including an edge coupler, and an optical fiber connector including a frame, an optical fiber mounted in the groove of the of the package substrate chip and passing through the frame, and an alignment pin extending from the frame to an inside of the alignment hole, wherein the edge coupler is located at one end of the photo-electron conversion unit.

公开(公告)号：US20250087651A1

公开(公告)日：2025-03-13

申请号：US18646858

申请日：2024-04-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghoon Kang ,  Daegon Kim

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/04 ,  H01L23/48 ,  H01L23/498

Abstract: A semiconductor package includes a package substrate including a first surface and a second surface opposite the first surface, a die disposed on the first surface of the package substrate, a stack structure disposed on the first surface of the package substrate and spaced apart from the die in a horizontal direction, and a socket disposed between the first surface of the package substrate and the stack structure and coupling the package substrate and the stack structure to each other, wherein the stack structure includes a plurality of optical integrated circuit chips stacked vertically with each other.