公开(公告)号：US20240371718A1

公开(公告)日：2024-11-07

申请号：US18507369

申请日：2023-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daehan YOUN ,  Youngsang CHO ,  Kyoung-Min LEE ,  Junho HUH

IPC: H01L23/36 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L25/065

Abstract: A semiconductor package includes a first package substrate including a first redistribution layer, at least one semiconductor chip disposed on the first redistribution layer and including a semiconductor device, and a second package substrate disposed on the at least one semiconductor chip and including a second redistribution layer. The at least one semiconductor chip includes at least one heat dissipation via having one end adjacent to the semiconductor device and penetrating through at least a portion of the at least one semiconductor chip, and another end contacting the second package substrate. The at least one heat dissipation via is a dissipation path of heat generated from the semiconductor device.