公开(公告)号：US11428645B2

公开(公告)日：2022-08-30

申请号：US17026494

申请日：2020-09-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kihak Nam ,  Sungyoon Ryu ,  Kwangeun Kim ,  Hwiwoo Park ,  Dayoung Yoon ,  Myoungkyu Choi

IPC: G01N21/95 ,  H01L21/687 ,  G01N21/55 ,  G01N21/21

Abstract: According to embodiments, a wafer inspection device is provided. The wafer inspection device includes a porous chuck including a plurality of pores formed all over the porous chuck to allow pressure for fixing a wafer to be applied thereto, a chuck driving device, a back side inspection optical system configured to inspect a portion of a back surface of the wafer, and a position identification optical system, wherein the porous chuck includes a plurality of holes uniformly formed all over the porous chuck to partially expose the back surface of the wafer and a slit exposing the back surface of the wafer and extending in one direction parallel to a top surface of the porous chuck.