公开(公告)号：US20230194567A1

公开(公告)日：2023-06-22

申请号：US17878414

申请日：2022-08-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwangeun Kim ,  Seungbum Hong ,  Sungyoon Ryu ,  Hoon Kim ,  Jiwon Yeom ,  Seokjung Yun ,  Souk Kim ,  Younghoon Sohn ,  Yusin Yang

IPC: G01Q40/00 ,  H01L21/66 ,  G01Q70/10

CPC classification number: G01Q40/00 ,  H01L22/12 ,  G01Q70/10 ,  H01L27/10876

Abstract: A method of operating an atomic force microscope (AFM) is provided. The method includes inspecting a sample by using the AFM and inspecting a tip of a probe of the AFM by using a characterization sample. The characterization sample includes a first characterization pattern that includes a line and space pattern of a first height, a second characterization pattern that includes a line and space pattern of a second height that is lower than the first height, and a third characterization pattern that includes a line and space pattern of a third height that is lower than the second height, and includes a rough surface.

公开(公告)号：US20240192154A1

公开(公告)日：2024-06-13

申请号：US18243835

申请日：2023-09-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwangeun Kim ,  Sewon Kim ,  Huisoo Kim ,  Jeongho Ahn ,  Sungeun Lee

IPC: G01N23/2251

CPC classification number: G01N23/2251 ,  G01N2223/42 ,  G01N2223/6116

Abstract: A pattern inspection apparatus includes a sample including a plurality of holes having thicknesses that are different from each other, an electron gun configured to generate an input electron beam and emit the input electron beam onto a wafer and the sample, a stage configured to support the wafer and the sample, a detector configured to generate a scanning electron microscope (SEM) image by detecting emitted electrons from the wafer and the sample, and a processor configured to process the SEM image into a three-dimensional profiling image containing depth information of the wafer and determine whether a condition of the input electron beam has changed based on the processing of the SEM image.

公开(公告)号：US12092656B2

公开(公告)日：2024-09-17

申请号：US17721522

申请日：2022-04-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyoon Ryu ,  Seungbum Hong ,  Kwangeun Kim ,  Hoon Kim ,  Jiwon Yeom ,  Seokjung Yun ,  Souk Kim ,  Younghoon Sohn ,  Yusin Yang

IPC: G01R1/067 ,  G01N29/06 ,  G01R1/04 ,  G01R1/073

CPC classification number: G01R1/06727 ,  G01R1/04

Abstract: A test apparatus includes a movable stage to support a sample, tips above the stage that have different shapes and alternately perform profiling and milling on the sample, a tip stage connected to a cantilever coupled to the tips, the tip stage to adjust a position of the cantilever, a position sensor to obtain information about a positional relationship between the tips and the sample, a stage controller to control movements of the stage and the tip stage, based on the information about the positional relationship, and a tip controller to select the tips for performing the profiling or milling and to determine conditions for performing milling, wherein a depth of the sample being processed by the milling in the first direction is controlled based on a relationship between a distance between the tips and the sample and a force between the tips and the sample.

公开(公告)号：US11428645B2

公开(公告)日：2022-08-30

申请号：US17026494

申请日：2020-09-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kihak Nam ,  Sungyoon Ryu ,  Kwangeun Kim ,  Hwiwoo Park ,  Dayoung Yoon ,  Myoungkyu Choi

IPC: G01N21/95 ,  H01L21/687 ,  G01N21/55 ,  G01N21/21

Abstract: According to embodiments, a wafer inspection device is provided. The wafer inspection device includes a porous chuck including a plurality of pores formed all over the porous chuck to allow pressure for fixing a wafer to be applied thereto, a chuck driving device, a back side inspection optical system configured to inspect a portion of a back surface of the wafer, and a position identification optical system, wherein the porous chuck includes a plurality of holes uniformly formed all over the porous chuck to partially expose the back surface of the wafer and a slit exposing the back surface of the wafer and extending in one direction parallel to a top surface of the porous chuck.