公开(公告)号：US09384105B2

公开(公告)日：2016-07-05

申请号：US14185447

申请日：2014-02-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min Kim ,  Yean-Sang You ,  Won-Gil Han ,  Ho-Am Kim ,  Byong-Joo Kim ,  Do-Hoon Lee

IPC: G06F11/00 ,  G06F11/26 ,  G01R31/04 ,  G01R31/02

CPC classification number: G06F11/26 ,  G01R31/025 ,  G01R31/04 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: In a method of detecting faults of operation algorithms in a wire bonding machine, individual bond parameters with respect to each of the operation algorithms of the wire bonding machine can be set based on design data including information with respect to conductive wires connected between semiconductor chips of a semiconductor package. Actual conductive wires of an actual semiconductor package can be formed using the wire bonding machine into which the design data can be inputted. Actual data with respect to actual operation algorithms of the wire bonding machine, which can form the actual conductive wires, can be obtained. The actual data can be compared with the individual bond parameters to detect the faults of the operation algorithms of the wire bonding machine. Thus, forming an abnormal conductive wire by the wire bonding machine can be prevented beforehand.

Abstract translation: 在线接合机中检测运算算法的故障的方法中，可以基于设计数据设定相关于引线键合机的各运算算法的各个结合参数，该设计数据包括关于连接在半导体芯片 半导体封装。 可以使用可以输入设计数据的引线接合机来形成实际的半导体封装的实际导线。 可以获得关于可形成实际导线的引线接合机的实际操作算法的实际数据。 实际数据可以与各自的绑定参数进行比较，以检测引线接合机的操作算法的故障。 因此，可以预先防止由引线接合机形成异常导电线。

公开(公告)号：US20140359372A1

公开(公告)日：2014-12-04

申请号：US14185447

申请日：2014-02-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min Kim ,  Yean-Sang You ,  Won-Gil Han ,  Ho-Am Kim ,  Byong-Joo Kim ,  Do-Hoon Lee

IPC: G05B23/02

CPC classification number: G06F11/26 ,  G01R31/025 ,  G01R31/04 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: In a method of detecting faults of operation algorithms in a wire bonding machine, individual bond parameters with respect to each of the operation algorithms of the wire bonding machine can be set based on design data including information with respect to conductive wires connected between semiconductor chips of a semiconductor package. Actual conductive wires of an actual semiconductor package can be formed using the wire bonding machine into which the design data can be inputted. Actual data with respect to actual operation algorithms of the wire bonding machine, which can form the actual conductive wires, can be obtained. The actual data can be compared with the individual bond parameters to detect the faults of the operation algorithms of the wire bonding machine. Thus, forming an abnormal conductive wire by the wire bonding machine can be prevented beforehand.

Abstract translation: 在线接合机中检测运算算法的故障的方法中，可以基于设计数据设定相关于引线键合机的各运算算法的各个结合参数，该设计数据包括关于连接在半导体芯片 半导体封装。 可以使用可以输入设计数据的引线接合机来形成实际的半导体封装的实际导线。 可以获得关于可形成实际导线的引线接合机的实际操作算法的实际数据。 实际数据可以与各自的绑定参数进行比较，以检测引线接合机的操作算法的故障。 因此，可以预先防止由引线接合机形成异常导电线。