中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

16 records (took 0.031 seconds)

    Apparatus and method for inspecting semiconductor
    2.
    发明授权
    Apparatus and method for inspecting semiconductor 有权

    公开(公告)号：US12025652B2

    公开(公告)日：2024-07-02

    申请号：US17853079

    申请日：2022-06-29

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Mi-Sol Youn ,  Min Kim ,  Kyoung Woon Min

    IPC: G01R31/28

    CPC classification number: G01R31/2817 ,  G01R31/2889

    Abstract: An apparatus and a method for inspecting a semiconductor includes a water tank which includes a housing, an interior of which is filled with a liquid, and a support block which provides a settling surface for an inspection object inside the housing. A plurality of signal generators are installed on a bottom surface of the housing, and output a frequency signal in a direction in which the inspection object is located. A power supply operates the signal generators. A probe is placed above the inspection object, and a receiver which operates with the probe and is attached to a bottom surface of the support block. Foreign matter remaining on the inspection object are removed, using a plurality of frequency signals which are output by the plurality of signal generating units.

    Method and apparatus of allocating resources for terminal in wireless communication system
    5.
    发明授权
    Method and apparatus of allocating resources for terminal in wireless communication system 有权

    公开(公告)号：US09913280B2

    公开(公告)日：2018-03-06

    申请号：US14968009

    申请日：2015-12-14

    Applicant: Samsung Electronics Co., Ltd. ,  KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION

    Inventor： Yongseok Park ,  Hwangnam Kim ,  Chulho Lee ,  Min Kim ,  Hyunsoon Kim ,  Woonghee Lee ,  Joon Yeop Lee

    IPC: H04W72/04 ,  H04W72/02

    CPC classification number: H04W72/048 ,  H04W72/02

    Abstract: Disclosed is a terminal effectively allocating communication resources to individual processes run by the user. The terminal may update a list of running processes based on information for one or more processes, determining the amount of resources for each process in the list according to priority information of the process related information, and allocating resources to at least one process in the list according to the determined resource amounts. Accordingly, the terminal can adjust throughputs of individual processes to support quality of communication of a process having high priority. This disclosure relates to communication methods and systems that achieve convergence of 5G communication systems supporting even higher data rates after 4G systems and IoT technologies. Based on IoT technologies, this disclosure may be applied to intelligent services, including smart homes, smart buildings, smart cities, smart/connected cars, health-care applications, digital education applications, retail business applications, and security and safety services.

    Apparatus for mounting semiconductor chips on a circuit board
    6.
    发明授权
    Apparatus for mounting semiconductor chips on a circuit board 有权
    用于将半导体芯片安装在电路板上的装置

    公开(公告)号：US08905290B2

    公开(公告)日：2014-12-09

    申请号：US14089366

    申请日：2013-11-25

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Il-Soo Choi ,  Min Kim ,  Tae-Ho Moon ,  Ju-Young Yu ,  Sung-Bok Hong

    IPC: B23K37/00 ,  B23K31/02 ,  H01L23/00

    CPC classification number: H01L24/75 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/757 ,  H01L2224/759 ,  H01L2224/81024 ,  H01L2224/81815 ,  H01L2924/14 ,  H01L2924/014

    Abstract: A chip mounting apparatus includes a loading unit, a combining unit and a bonding unit. The loading unit loads a circuit board having contact pads and semiconductor chips having solder balls into the chip mounting apparatus. The combining unit positions the semiconductor chip onto a respective mounting area of the circuit board and combines the solder balls of the semiconductor chip with the contact pads of the circuit board by using flux. The combining unit has a flux coater for coating the solder balls with the flux and a flux controller for automatically supplementing the flux to the flux coater. The bonding unit bonds the solder balls to the respective contact pads by a reflow process.

    Abstract translation: 芯片安装装置包括加载单元，组合单元和结合单元。 装载单元将具有接触焊盘的电路板和具有焊球的半导体芯片加载到芯片安装装置中。 组合单元将半导体芯片定位在电路板的相应安装区域上，并且通过使用焊剂将半导体芯片的焊球与电路板的接触焊盘组合。 组合单元具有用于涂覆助焊剂的焊剂焊剂和用于将焊剂自动补充到焊剂涂布机的焊剂控制器的焊剂涂布机。 接合单元通过回流工艺将焊球接合到相应的接触焊盘。

    METHOD AND APPARATUS FOR SCHEDULING VIDEO TRAFFIC IN WIRELESS COMMUNICATION SYSTEM
    7.
    发明申请
    METHOD AND APPARATUS FOR SCHEDULING VIDEO TRAFFIC IN WIRELESS COMMUNICATION SYSTEM 审中-公开
    用于在无线通信系统中调度视频流量的方法和装置

    公开(公告)号：US20140307624A1

    公开(公告)日：2014-10-16

    申请号：US14253829

    申请日：2014-04-15

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Min Kim ,  Yong-Seok Park ,  Chul-Ki Lee

    IPC: H04L12/863 ,  H04N21/61

    CPC classification number: H04N21/6131 ,  H04N21/23805 ,  H04N21/26216 ,  H04N21/26241 ,  H04W4/00

    Abstract: A method of scheduling video traffic in a wireless communication system includes detecting codec information and a number of video frames included in at least one video traffic. The method also includes predicting a reproduction time of the at least one video traffic by using the codec information and the number of video frames. The method also includes performing scheduling of the at least one video traffic based on the predicted reproduction time.

    Abstract translation: 一种在无线通信系统中调度视频流量的方法包括：检测编码解码器信息和包括在至少一个视频流量中的多个视频帧。 该方法还包括通过使用编解码器信息和视频帧的数量来预测至少一个视频业务的再现时间。 该方法还包括基于预测的再现时间执行至少一个视频业务的调度。

    Audio apparatus and method of controlling the same
    8.
    发明授权
    Audio apparatus and method of controlling the same 有权

    公开(公告)号：US11968521B2

    公开(公告)日：2024-04-23

    申请号：US17267354

    申请日：2019-08-08

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Ho Seok Wey ,  Min Kim ,  Tae Woo Kim ,  Young Jo Seo ,  Sang-Il Choi

    IPC: H04S3/00 ,  H04S7/00

    CPC classification number: H04S7/307 ,  H04S3/008 ,  H04S2400/01 ,  H04S2400/05

    Abstract: An audio apparatus includes a signal receiver configured to receive a left-channel signal and a right-channel signal of a stereo audio signal; at least one filter configured to block a signal in a band exceeding a predetermined frequency based on the frequency bands of each of the received left-channel signal and right-channel signal; and a controller configured to generate a center-channel signal of the stereo audio signal based on the left-channel signal and the right-channel signal passing through the filter, to calculate a signal level sensitivity between the left-channel signal and the right-channel signal passing through the filter, to determine a similarity between the left-channel signal and the right-channel signal based on the calculated signal level sensitivity, and to control the generated center-channel signal to be output in response to the determined similarity.

    Electronic apparatus, control method thereof, and recording medium
    9.
    发明授权
    Electronic apparatus, control method thereof, and recording medium 有权

    公开(公告)号：US11589180B2

    公开(公告)日：2023-02-21

    申请号：US17270208

    申请日：2019-08-21

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hoseok Wey ,  Michael Kohnen ,  Min Kim

    IPC: H04S7/00 ,  G10L19/008 ,  H04N5/60

    Abstract: The disclosure relates to an electronic apparatus, a control method thereof, and a recording medium. The electronic apparatus includes: a signal processor configured to process a sound signal; and a processor configured to acquire positional information of a speaker that outputs sound, based on the processed sound signal, and perform a first correction so that a sound image of the sound signal has a predetermined reference spatial acoustic characteristic based on the acquired positional information of the speaker, and perform a second correction so that the sound image of the sound signal on which the first correction is performed has a target spatial acoustic characteristic.

    Method of detecting faults of operation algorithms in a wire bonding machine and apparatus for performing the same
    10.
    发明授权
    Method of detecting faults of operation algorithms in a wire bonding machine and apparatus for performing the same 有权
    用于检测引线接合机中的操作算法的故障的方法及其执行方法

    公开(公告)号：US09384105B2

    公开(公告)日：2016-07-05

    申请号：US14185447

    申请日：2014-02-20

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Min Kim ,  Yean-Sang You ,  Won-Gil Han ,  Ho-Am Kim ,  Byong-Joo Kim ,  Do-Hoon Lee

    IPC: G06F11/00 ,  G06F11/26 ,  G01R31/04 ,  G01R31/02

    CPC classification number: G06F11/26 ,  G01R31/025 ,  G01R31/04 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: In a method of detecting faults of operation algorithms in a wire bonding machine, individual bond parameters with respect to each of the operation algorithms of the wire bonding machine can be set based on design data including information with respect to conductive wires connected between semiconductor chips of a semiconductor package. Actual conductive wires of an actual semiconductor package can be formed using the wire bonding machine into which the design data can be inputted. Actual data with respect to actual operation algorithms of the wire bonding machine, which can form the actual conductive wires, can be obtained. The actual data can be compared with the individual bond parameters to detect the faults of the operation algorithms of the wire bonding machine. Thus, forming an abnormal conductive wire by the wire bonding machine can be prevented beforehand.

    Abstract translation: 在线接合机中检测运算算法的故障的方法中，可以基于设计数据设定相关于引线键合机的各运算算法的各个结合参数，该设计数据包括关于连接在半导体芯片 半导体封装。 可以使用可以输入设计数据的引线接合机来形成实际的半导体封装的实际导线。 可以获得关于可形成实际导线的引线接合机的实际操作算法的实际数据。 实际数据可以与各自的绑定参数进行比较，以检测引线接合机的操作算法的故障。 因此，可以预先防止由引线接合机形成异常导电线。

Patent Agency Ranking