公开(公告)号：US10739816B2

公开(公告)日：2020-08-11

申请号：US15131096

申请日：2016-04-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byoung-Ju Ahn ,  Doheang Kang ,  Jungchul Kim ,  Soo Jin Park ,  Young Jae Lee

IPC: C23C14/06 ,  H04M1/02 ,  G06F1/16 ,  B29D99/00 ,  B44C3/00 ,  B32B37/14 ,  B32B43/00 ,  B32B37/24 ,  B32B38/10

Abstract: A method for manufacturing a housing, comprising: laminating a first deposition layer on a preform; laminating an intermediate layer on the first deposition layer; laminating a second deposition layer on the intermediate layer; applying a color paint layer on the second deposition layer; delaminating at least some of the color paint layer and the second deposition layer to form at least one delaminated area; and forming a printing layer in the delaminated area, wherein the first deposition layer is visible through at least some areas of the printing layer.