公开(公告)号：US10672694B2

公开(公告)日：2020-06-02

申请号：US15397970

申请日：2017-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong-suk Kim ,  Kyong-soon Cho ,  Shle-ge Lee ,  Yu-duk Kim

IPC: H01L23/498 ,  H05K3/46 ,  H01L21/48 ,  H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

Abstract: A printed circuit board (PCB) reducing a thickness of a semiconductor package and improving reliability of the semiconductor package, a semiconductor package including the PCB, and a method of manufacturing the PCB may be provided. The PCB may include a substrate base having at least one base layer, and a plurality of wiring layers disposed on a top surface and a bottom surface of the at least one base layer, the plurality of wiring layers defining a plurality of wiring patterns, respectively may be provided. An elastic modulus of a conductive material of one wiring pattern of at least one wiring layer from among the plurality of wiring layers may be less than a conductive material of another wiring pattern.