公开(公告)号：US20230353684A1

公开(公告)日：2023-11-02

申请号：US18349374

申请日：2023-07-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghyun KIM ,  Baekgyeong KIM ,  Gangyoul KIM ,  Misun KIM ,  Sangheon KIM ,  Mira SEO ,  Kwangyong CHOI ,  Dongyoon PARK ,  Yeunwook LIM

IPC: H04M9/08 ,  G06F3/14 ,  H04M9/10

CPC classification number: H04M9/082 ,  G06F3/1454 ,  H04M9/10

Abstract: An electronic device according to various embodiments comprises a communication module including communication circuitry, at least one microphone, and a processor. The processor can be configured to: be connected to an external device through the communication module; switch a call audio signal path to an external device output path in response to being call-connected to an opponent device; duplicate a call audio signal (Rx in) transmitted from the opponent device, provide a first signal to an echo removal module, and provide a second signal to the external device via the external device output path; measure latency between the external device and the electronic device; variably adjust the size of a dynamic buffer for removing echo, by applying the measured latency; generate a reference signal delayed in the second signal, by the adjusted dynamic buffer; and remove an echo signal, with respect to the first signal generated from a speaker of the external device, from a microphone input signal obtained from the at least one microphone, based on the generated reference signal.