公开(公告)号：US20220418097A1

公开(公告)日：2022-12-29

申请号：US17898907

申请日：2022-08-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunki YUN ,  Kwangkyu BANG ,  Jihong KIM ,  Eunji YU ,  Kyungjae KIM ,  Yusuf CINAR

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

Abstract: A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.

公开(公告)号：US20220124904A1

公开(公告)日：2022-04-21

申请号：US17358800

申请日：2021-06-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunki YUN ,  Kwangkyu BANG ,  Jihong KIM ,  Eunji YU ,  Kyungjae KIM ,  Yusuf CINAR

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/11

Abstract: A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.