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公开(公告)号：US20220124904A1
公开(公告)日：2022-04-21
申请号：US17358800
申请日：2021-06-25
发明人： Sunki YUN , Kwangkyu BANG , Jihong KIM , Eunji YU , Kyungjae KIM , Yusuf CINAR
摘要： A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.
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公开(公告)号：US20210161034A1
公开(公告)日：2021-05-27
申请号：US16952595
申请日：2020-11-19
发明人： Chihwan JEONG , Kyungha KOO , Jihong KIM , Dongku KANG , Kuntak KIM , Yunjeong PARK , Kyuhwan LEE , Haejin LEE , Seyoung JANG , Hyuntae JANG
摘要： The disclosure relates to a wireless charging device including a cooling fan, and the wireless charging device according to an embodiment of the disclosure includes: a housing including a holding portion configured to hold an external electronic device; a first bracket positioned in the holding portion; a conductive coil disposed in the first bracket; a second bracket positioned in the holding portion and including a penetrating hole; a first cooling fan positioned in the penetrating hole; a second cooling fan positioned in the penetrating hole and spaced apart from the first cooling fan; and a partition formed in the penetrating hole to isolate the first cooling fan and the second cooling fan from each other, the penetrating hole being divided into a first area having the first cooling fan disposed therein and a second area having the second cooling fan positioned therein, at least one protrusion having a volute shape formed on at least a portion of the second bracket or at least a portion of the partition, a first opening formed on at least an area of the first bracket to allow air cooled by the first cooling fan and/or the second cooling fan to move to the holding portion, and a second opening formed on at least an area of the holding portion to allow the air transmitted from the first opening to move outside the wireless charging device.
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公开(公告)号：US20170047769A1
公开(公告)日：2017-02-16
申请号：US15202171
申请日：2016-07-05
发明人： Kihyun KIM , Kyungha KOO , Wooram LEE , Changhyung LEE , Jihye KIM , Jihong KIM , Yunjeong NOH , Seho PARK , Kumjong SUN , Ju-Hyang LEE , Mincheol HA , Sangmoo HWANGBO
CPC分类号： H02J7/025 , H02J7/0029 , H02J50/80
摘要： An electronic device is provided. The electronic device includes a housing, a wireless charging coil disposed inside the housing, a fan disposed inside the housing and in proximity to the coil, a temperature sensor disposed inside the housing and in proximity to the coil, a wireless charging circuit having the coil and configured to transmit power wirelessly to an external device via the coil, and a control circuit electrically connected to the fan, the temperature sensor, and the wireless charging circuit. The control circuit may be configured to receive a signal from the external device, receive data related to a temperature of the coil from the temperature sensor, and control the fan at least partially on the basis of at least one of the signal and the data.
摘要翻译： 提供电子设备。 电子设备包括壳体，设置在壳体内部的无线充电线圈，设置在壳体内并且靠近线圈的风扇，设置在壳体内部并且靠近线圈的温度传感器，具有线圈的无线充电电路 并被配置为经由线圈向外部设备无线地发送电力，以及电连接到风扇，温度传感器和无线充电电路的控制电路。 控制电路可以被配置为从外部设备接收信号，从温度传感器接收与线圈温度有关的数据，并且至少部分地基于信号和数据中的至少一个来控制风扇。
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公开(公告)号：US20240353118A1
公开(公告)日：2024-10-24
申请号：US18593668
申请日：2024-03-01
发明人： Bohyun KIM , Jihong KIM , Juwan PARK , Kyeongae LEE , Changsik LEE , Sunghyun CHUN , Wonhee LEE
IPC分类号： F24F1/031
CPC分类号： F24F1/031
摘要： A mounting device configured to mount an air conditioner on a window frame, includes: a fixing frame configured to hold the air conditioner and be fixable to a lower portion of the window frame; a moving frame configured to move up and down with respect to the fixing frame and to be fixable to an upper portion of the window frame; and an indicator disposed on the moving frame and configured to contact the upper portion of the window frame, wherein the indicator includes: a first indicating portion configured to be visible from an outside of the moving frame when the moving frame is not fixed to the upper portion of the window frame; and a second indicating portion different from the first indicating portion, and configured to be visible from the outside of the moving frame when the moving frame is fixed to the upper portion.
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公开(公告)号：US20240183546A1
公开(公告)日：2024-06-06
申请号：US18442453
申请日：2024-02-15
发明人： Hyunho KIM , Jihong KIM , Hongyeol MOON , Wooyoung PARK , Byungyul SO , Mingu JEON , Changwoo JUNG
IPC分类号： F24F1/0076 , F24F1/0047 , F24F1/0073 , F24F11/88 , F24F13/20 , F24F13/28
CPC分类号： F24F1/0076 , F24F1/0073 , F24F11/88 , F24F13/20 , F24F13/28 , F24F1/0047 , F24F2221/14
摘要： An air conditioner includes a housing comprising an outlet, a panel attachable to or detachable from a lower side of the housing, the panel comprising an inlet to introduce air therethrough, a first filter installable to the panel to filter the introduced air, a second filter installable to the panel at an upper side of the first filter and configured to further filter the introduced air, and a lifter configured to detach the panel from the lower side of the housing by lowering the panel from an initial position to a maintenance position in a vertical direction, and to attach the panel to the lower side of the housing by lifting the panel from the maintenance position to the initial position in the vertical direction. By lowering the panel to the maintenance position, one or more of the first filter and the second filter are accessible for the maintenance.
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公开(公告)号：US20230215826A1
公开(公告)日：2023-07-06
申请号：US18147501
申请日：2022-12-28
发明人： Jihong KIM
IPC分类号： H01L23/00 , H01L25/065 , H01L25/18
CPC分类号： H01L24/08 , H01L25/0657 , H01L25/18 , H01L2224/08145 , H01L2924/1431 , H01L2924/1441 , H01L2924/1443 , H01L2924/1444 , H01L2924/14511
摘要： A semiconductor device includes a first non-volatile memory structure including a first stack structure including first conductive lines stacked and spaced apart from each other and a first vertical memory structure penetrating through the first stack structure; a second non-volatile memory structure including a second stack structure including second conductive lines stacked and spaced apart from each other and a second vertical memory structure penetrating through the second stack structure; and a peripheral circuit structure electrically connected to the first and second non-volatile memory structures. The peripheral circuit structure, the first non-volatile memory structure, and the second non-volatile memory structure vertically overlap each other. The first vertical memory structure includes a first data storage structure including a first data storage material layer. The second vertical memory structure includes a second data storage structure including a second data storage material layer that is different from the first data storage material layer.
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公开(公告)号：US20220418097A1
公开(公告)日：2022-12-29
申请号：US17898907
申请日：2022-08-30
发明人： Sunki YUN , Kwangkyu BANG , Jihong KIM , Eunji YU , Kyungjae KIM , Yusuf CINAR
摘要： A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.
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公开(公告)号：US20220121253A1
公开(公告)日：2022-04-21
申请号：US17567326
申请日：2022-01-03
发明人： Seunghoon LEE , Yongbum KIM , Jihong KIM , Sangwoo PARK , Minchang SHIM , Sangwon LEE , Sungbok LEE , Changhyung LEE , Hanshil CHOI
摘要： Disclosed is a cooler according to various embodiments of the disclosure. The cooler may have an electronic device mounted thereon, which includes a front surface on which a display area is formed and a rear surface opposite the front surface. The cooler may include a housing including a first surface, a second surface opposite the first surface, and a third surface that surrounds an interior space between the first surface and the second surface, the first surface including a seating area on which the rear surface of the electronic device is seated and a recess area spaced apart from the rear surface of the electronic device by a predetermined gap, and a fan disposed in the interior space of the housing and including a rotary shaft formed in a direction toward the first surface from the second surface.
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公开(公告)号：US20190229550A1
公开(公告)日：2019-07-25
申请号：US16371690
申请日：2019-04-01
发明人： Kihyun KIM , Kyungha KOO , Wooram LEE , Changhyung LEE , Jihye KIM , Jihong KIM , Yunjeong NOH , Seho PARK , Kumjong SUN , Ju-Hyang LEE , Mincheol HA , Sangmoo HWANGBO
摘要： An electronic device is provided. The electronic device includes a housing, a wireless charging coil disposed inside the housing, a fan disposed inside the housing and in proximity to the coil, a temperature sensor disposed inside the housing and in proximity to the coil, a wireless charging circuit having the coil and configured to transmit power wirelessly to an external device via the coil, and a control circuit electrically connected to the fan, the temperature sensor, and the wireless charging circuit. The control circuit may be configured to receive a signal from the external device, receive data related to a temperature of the coil from the temperature sensor, and control the fan at least partially on the basis of at least one of the signal and the data.
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公开(公告)号：US20240040797A1
公开(公告)日：2024-02-01
申请号：US18142291
申请日：2023-05-02
发明人： Hyunmook CHOI , Jihong KIM , Siyeon CHO
IPC分类号： H10B51/30
CPC分类号： H10B51/30
摘要： A three-dimensional non-volatile memory device includes horizontal word lines separated from each other in a vertical direction, horizontal ferroelectric layers arranged among the horizontal word lines, the horizontal ferroelectric layers including upper horizontal ferroelectric layers and lower horizontal ferroelectric layers, vertical ferroelectric layers contacting side walls of the horizontal ferroelectric layers and extending in the vertical direction, a semiconductor pillar passing through the horizontal word lines in the vertical direction, and a channel region between the horizontal word lines and the semiconductor pillar, wherein the upper horizontal ferroelectric layers and the lower horizontal ferroelectric layers are separated from each other by an air gap in the vertical direction.
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