公开(公告)号：US11284538B2

公开(公告)日：2022-03-22

申请号：US16988980

申请日：2020-08-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohhyuck Kwon ,  Min Park ,  Jaeyoung Huh ,  Daesuk Kang ,  Ji Eom ,  Ewidon Jeong ,  Sungchul Park

IPC: H05K7/20 ,  G06F1/20 ,  H01Q1/02

Abstract: A composite heat dissipation member and an electronic device comprising the composite heat dissipation member. The composite head dissipation member may include a first heat dissipation sheet disposed to be overlapped with an antenna module, and a second heat dissipation sheet disposed adjacent to the first heat dissipation sheet without an overlap with the first heat dissipation sheet, thermally connected to the first heat dissipation sheet, and having a higher thermal conductivity than the first heat dissipation sheet.