公开(公告)号：US20170134852A1

公开(公告)日：2017-05-11

申请号：US15346168

申请日：2016-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gi Hoon LEE ,  Jae Hwan LEE ,  Byeng Sang JUNG

IPC: H04R3/00 ,  H04R29/00

CPC classification number: H04R3/00 ,  H04R5/04 ,  H04R25/556 ,  H04R29/00 ,  H04R2420/01 ,  H04R2420/05

Abstract: An electronic device is provided which includes an audio jack that receives an audio plug comprising a plurality of terminals and a plurality of insulating members arranged among the plurality of terminals, the audio plug comprises a plurality of contacts that are capable of contacting the plurality of terminals or the plurality of insulating members, a circuit that is electrically connected with the plurality of contacts and configured to send an audio signal to the audio plug, and a processor configured to control the circuit, wherein at least one of the plurality of contacts is electrically connected with a ground and is configured to contact one of the plurality of insulating members of the audio plug if the audio plug is matched with the audio jack.

公开(公告)号：US20170149942A1

公开(公告)日：2017-05-25

申请号：US15357368

申请日：2016-11-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gi Hoon LEE ,  Hyun Woo SIM

IPC: H04M1/03 ,  H04M1/02

CPC classification number: H04M1/03 ,  H04B1/3888 ,  H04M1/026 ,  H04M1/0277 ,  H04R1/023 ,  H04R1/086 ,  H04R2499/11

Abstract: An electronic device and a method of manufacturing the electronic device is provided. The electronic device includes a housing, a structure that is formed on a surface of the housing and comprises a first pattern having a first at least one through-hole, a first speaker that is arranged in an interior of the housing to be adjacent to a first portion of the first pattern and is configured to output a sound, and a first microphone that is arranged in the interior of the housing to be adjacent to a second portion of the first pattern and is configured to receive a sound.